EEWORLDEEWORLDEEWORLD

Part Number

Search

BZX584C9V1-02V-GS08

Description
Zener Diode, 9.1V V(Z), 6.6%, 0.2W,
CategoryDiscrete semiconductor    diode   
File Size50KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

BZX584C9V1-02V-GS08 Overview

Zener Diode, 9.1V V(Z), 6.6%, 0.2W,

BZX584C9V1-02V-GS08 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerVishay
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode typeZENER DIODE
Maximum dynamic impedance40 Ω
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Maximum operating temperature150 °C
Maximum power dissipation0.2 W
Nominal reference voltage9.1 V
surface mountYES
Terminal surfaceMatte Tin (Sn)
Maximum voltage tolerance6.6%
Working test current5 mA
BZX584C-02V Series
Vishay Semiconductors
Small Signal Zener Diodes
Features
• With the BZX584C..-02V series vishay
offers a Z-Diode in the tiny SOD-523
plastic package. Made for space
sensitive applications the BZX584C..-
02V series has a zener voltage tolerance
of ± 5 %.
• Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
1
1
2
2
18426
Mechanical Data
Case:
SOD-523
Weight:
approx. 1.6 mg
Packaging codes/options:
GS08/3 k per 7" reel (8 mm tape), 15 k/box
Absolute Maximum Ratings
T
amb
= 25 °C, unless otherwise specified
Parameter
Power dissipation
Note:
1)
Device on fiberglass substrate
Test condition
Symbol
P
tot
Value
200
1)
Unit
mW
Thermal Characteristics
T
amb
= 25 °C, unless otherwise specified
Parameter
Thermal resistance junction to ambient air
Thermal resistance junction to soldering
point
Junction temperature
Storage temperature range
Note:
1)
Device on fiberglass substrate
Test condition
Symbol
R
thJA
R
thJS
T
j
T
stg
Value
680
1)
100
150
- 65 to + 150
Unit
K/W
K/W
°C
°C
Document Number 85793
Rev. 1.6, 22-Feb-10
For technical support, please contact:
DiodesSSP@vishay.com
www.vishay.com
1
EEWORLD University ---- Application of Thermal Imagers in R&D and Quality Management
Application of Thermal Imagers in RD and Quality Management : https://training.eeworld.com.cn/course/625...
chenyy Talking
DSP solves industry problems
In the electronics industry, DSP high-speed computing is suitable for image and audio compression and encoding and decoding, but not suitable for running interfaces. ARM fills this gap. Therefore, amo...
ywhfdl DSP and ARM Processors
About 28035 SPI
What needs to be done for SPI initialization?...
l0700830216 Microcontroller MCU
What to do if data is lost?
I believe that those who do embedded development know that non-volatile data storage is usually Flash, but there will usually be data loss. However, I have been thinking about what causes data loss. I...
li139 Embedded System
Some questions about uboot startup kernel
We know that the general process of uboot starting the kernel is: start.s-->start_armboot-->main_loop-->rum_command-->do_bootm-->do_bootm_liunx But some of the specific details are still not clear. 1....
sailbeyond Linux and Android
RS485 receives garbled codes
I would be grateful if the expert can give me some advice! I am using Shengbo's CSD communication card, which has four independent serial ports, which can be set to any of rs232, rs422, and rs485. I h...
yoshiki117 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2209  2202  331  1900  428  45  7  39  9  38 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号