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BZT52B20S

Description
Zener Diode, 20V V(Z), 2%, 0.2W, Silicon, Unidirectional, PLASTIC PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size107KB,3 Pages
ManufacturerMicro Commercial Components (MCC)
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Zener Diode, 20V V(Z), 2%, 0.2W, Silicon, Unidirectional, PLASTIC PACKAGE-2

BZT52B20S Parametric

Parameter NameAttribute value
MakerMicro Commercial Components (MCC)
package instructionR-PDSO-F2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeR-PDSO-F2
JESD-609 codee0
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation0.2 W
Certification statusNot Qualified
Nominal reference voltage20 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formFLAT
Terminal locationDUAL
Maximum voltage tolerance2%
Working test current5 mA
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

  !"#
$ %    !"#
BZT52B4V3S
THRU
BZT52B39S
200 mW
Zener Diode
4.3
to 39 Volts
Features
Planar Die Construction
200mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Processes
Case Material: Molded Plastic.
Classification Rating 94V-0
UL Flammability
SOD323
A
Absolute Maximum Ratings
Symbol
P
D
T
J
T
STG
Parameter
Power dissipation
Junction Temperature
Storage Temperature Range
Rating
200
-65 to +175
-65 to +175
Unit
mW
B
C
E
F
D
G
Absolute Maximum Ratings
Symbol
R
thJA
Parameter
Thermal Resistance Junction to
Ambient*
Rating
305
Unit
/W
DIM
A
B
C
D
E
F
G
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25
mm
2
Electrical Characteristics
Symbol
Parameter
Rating
Unit
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.090
.107
2.30
2.70
.068
.078
1.75
1.95
.045
.054
1.15
1.35
.027
.038
0.70
0.95
.009
.014
0.25
0.35
.002
.006
0.05
0.15
.012
---
0.30
---
SUGGESTED SOLDER
PAD LAYOUT
0.059"
NOTE
V
F
Maximum Forward Voltage
(I
F
=10mAdc)
0.9
V
0.039”
0.031”
Revision:
2
www.mccsemi.com
1 of
3
2007/07/13
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