Synchronous DRAM Module, 32MX64, 6ns, CMOS, SODIMM-144
| Parameter Name | Attribute value |
| Maker | SAMSUNG |
| Parts packaging code | MODULE |
| package instruction | , |
| Contacts | 144 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| access mode | FOUR BANK PAGE BURST |
| Maximum access time | 6 ns |
| JESD-30 code | R-XDMA-N144 |
| memory density | 2147483648 bit |
| Memory IC Type | SYNCHRONOUS DRAM MODULE |
| memory width | 64 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 144 |
| word count | 33554432 words |
| character code | 32000000 |
| Operating mode | SYNCHRONOUS |
| organize | 32MX64 |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Terminal form | NO LEAD |
| Terminal location | DUAL |
| KMM464S3254AT1-FH/FL | KMM464S824CT1-FH/FL | KMM464S924T1-FH/FL | KMM464S1654AT1-FH/FL | KMM464S424CT1-FH/FL | KMM464S1724T1-FH/FL | |
|---|---|---|---|---|---|---|
| Description | Synchronous DRAM Module, 32MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 8MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 4MX64, 6ns, CMOS, SODIMM-144 | Synchronous DRAM Module, 16MX64, 6ns, CMOS, SODIMM-144 |
| Parts packaging code | MODULE | MODULE | MODULE | MODULE | MODULE | MODULE |
| Contacts | 144 | 144 | 144 | 144 | 144 | 144 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| access mode | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| Maximum access time | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns |
| JESD-30 code | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 | R-XDMA-N144 |
| memory density | 2147483648 bit | 536870912 bit | 536870912 bit | 1073741824 bit | 268435456 bit | 1073741824 bi |
| Memory IC Type | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE | SYNCHRONOUS DRAM MODULE |
| memory width | 64 | 64 | 64 | 64 | 64 | 64 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 144 | 144 | 144 | 144 | 144 | 144 |
| word count | 33554432 words | 8388608 words | 8388608 words | 16777216 words | 4194304 words | 16777216 words |
| character code | 32000000 | 8000000 | 8000000 | 16000000 | 4000000 | 16000000 |
| organize | 32MX64 | 8MX64 | 8MX64 | 16MX64 | 4MX64 | 16MX64 |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | SAMSUNG | - | SAMSUNG | SAMSUNG | SAMSUNG | SAMSUNG |