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PM5363-BGI

Description
Support Circuit, 1-Func, CMOS, PBGA304, 31 X 31 MM, 1.51 MM HEIGHT, 1.27 MM PITCH, SBGA-304
CategoryWireless rf/communication    Telecom circuit   
File Size4MB,459 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
Download Datasheet Parametric Compare View All

PM5363-BGI Overview

Support Circuit, 1-Func, CMOS, PBGA304, 31 X 31 MM, 1.51 MM HEIGHT, 1.27 MM PITCH, SBGA-304

PM5363-BGI Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerMicrosemi
package instructionLBGA,
Reach Compliance Codecompliant
JESD-30 codeS-PBGA-B304
length31 mm
Humidity sensitivity level3
Number of functions1
Number of terminals304
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLBGA
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.7 mm
Nominal supply voltage2.5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesATM/SONET/SDH SUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature30
width31 mm
PM5363 TUPP+622
TUPP+622
DATASHEET
PMC-1981421
ISSUE 4
SONET/SDH TRIBUTARY UNIT PAYLOAD PROCESSOR FOR 622 MBIT/S
INTERFACES
PM5363
TUPP+622
SONET/SDH TRIBUTARY UNIT PAYLOAD PROCESSOR
FOR 622 MBIT/S INTERFACES
DATASHEET
RELEASED
ISSUE 4: JULY 2000
PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE

PM5363-BGI Related Products

PM5363-BGI
Description Support Circuit, 1-Func, CMOS, PBGA304, 31 X 31 MM, 1.51 MM HEIGHT, 1.27 MM PITCH, SBGA-304
Is it Rohs certified? conform to
Maker Microsemi
package instruction LBGA,
Reach Compliance Code compliant
JESD-30 code S-PBGA-B304
length 31 mm
Humidity sensitivity level 3
Number of functions 1
Number of terminals 304
Maximum operating temperature 85 °C
Minimum operating temperature -40 °C
Package body material PLASTIC/EPOXY
encapsulated code LBGA
Package shape SQUARE
Package form GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Celsius) 260
Certification status Not Qualified
Maximum seat height 1.7 mm
Nominal supply voltage 2.5 V
surface mount YES
technology CMOS
Telecom integrated circuit types ATM/SONET/SDH SUPPORT CIRCUIT
Temperature level INDUSTRIAL
Terminal form BALL
Terminal pitch 1.27 mm
Terminal location BOTTOM
Maximum time at peak reflow temperature 30
width 31 mm
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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