LM358AN datasheet, PDF - EEWORLD Datasheet

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LM358AN: DescriptionOperational Amplifier, 2 Func, 5000uV Offset-Max, BIPolar, PDIP8; CategoryAnalog mixed-signal IC Amplifier circuit; File Size511KB，10 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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LM358AN Overview

Operational Amplifier, 2 Func, 5000uV Offset-Max, BIPolar, PDIP8

LM358AN Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SAMSUNG
package instruction	DIP, DIP8,.3
Reach Compliance Code	unknown
Amplifier type	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK
Maximum bias current (IIB) at 25C	0.1 µA
frequency compensation	YES
Maximum input offset voltage	5000 µV
JESD-30 code	R-PDIP-T8
JESD-609 code	e0
low-dissonance	NO
Number of functions	2
Number of terminals	8
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP8,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	+-1.5/+-15/3/30 V
Certification status	Not Qualified
Maximum slew rate	2 mA
Supply voltage upper limit	16 V
surface mount	NO
technology	BIPOLAR
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
Minimum voltage gain	15000

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Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Amplifier type	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER	OPERATIONAL AMPLIFIER
Architecture	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK	VOLTAGE-FEEDBACK
Maximum bias current (IIB) at 25C	0.1 µA	0.15 µA	0.08 µA	0.15 µA	0.08 µA	0.15 µA	0.1 µA	0.08 µA	0.25 µA
frequency compensation	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum input offset voltage	5000 µV	7000 µV	4000 µV	7000 µV	4000 µV	7000 µV	5000 µV	4000 µV	10000 µV
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0
low-dissonance	NO	NO	NO	NO	NO	NO	NO	NO	NO
Number of functions	2	2	2	2	2	2	2	2	2
Number of terminals	8	9	9	8	8	8	9	8	9
Maximum operating temperature	70 °C	85 °C	85 °C	85 °C	85 °C	85 °C	70 °C	85 °C	85 °C
Minimum operating temperature	-	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-	-25 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
Encapsulate equivalent code	DIP8,.3	SIP9,.1	SIP9,.1	SOP8,.25	SOP8,.25	DIP8,.3	SIP9,.1	DIP8,.3	SIP9,.1
power supply	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-15/3/30 V	+-1.5/+-13/3/26 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum slew rate	2 mA	2 mA	2 mA	2 mA	2 mA	2 mA	2 mA	2 mA	2 mA
Supply voltage upper limit	16 V	16 V	16 V	16 V	16 V	16 V	16 V	16 V	13 V
surface mount	NO	NO	NO	YES	YES	NO	NO	NO	NO
technology	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR	BIPOLAR
Temperature level	COMMERCIAL	OTHER	OTHER	OTHER	OTHER	OTHER	COMMERCIAL	OTHER	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	DUAL	SINGLE	SINGLE	DUAL	DUAL	DUAL	SINGLE	DUAL	SINGLE
Minimum voltage gain	15000	25000	25000	25000	25000	25000	15000	25000	15000
Maker	SAMSUNG	-	-	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG	SAMSUNG
package instruction	DIP, DIP8,.3	, SIP9,.1	, SIP9,.1	SOP, SOP8,.25	SOP, SOP8,.25	DIP, DIP8,.3	, SIP9,.1	-	, SIP9,.1
JESD-30 code	R-PDIP-T8	-	-	R-PDSO-G8	R-PDSO-G8	R-PDIP-T8	-	R-PDIP-T8	-
encapsulated code	DIP	-	-	SOP	SOP	DIP	-	DIP	-
Package shape	RECTANGULAR	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	-
Package form	IN-LINE	-	-	SMALL OUTLINE	SMALL OUTLINE	IN-LINE	-	IN-LINE	-
Terminal form	THROUGH-HOLE	-	-	GULL WING	GULL WING	THROUGH-HOLE	-	THROUGH-HOLE	-

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