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LM358AN/A+

Description
IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size833KB,14 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Stay tuned Parametric Compare

LM358AN/A+ Overview

IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC

LM358AN/A+ Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerTexas Instruments
package instructionDIP, DIP8,.3
Reach Compliance Codeunknown
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
frequency compensationYES
Maximum input offset voltage5000 µV
JESD-30 codeR-PDIP-T8
JESD-609 codee0
low-dissonanceNO
Number of functions2
Number of terminals8
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
power supply+-1.5/+-15/3/30 V
surface mountNO
technologyBIPOLAR
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL

LM358AN/A+ Related Products

LM358AN/A+ LM358H/A+ LM358J/A+ LM358N/A+
Description IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC IC,OP-AMP,DUAL,BIPOLAR,CAN,8PIN,METAL LM358J/A+ IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC
Is it Rohs certified? incompatible incompatible incompatible incompatible
package instruction DIP, DIP8,.3 , CAN8,.2 DIP, DIP8,.3 DIP, DIP8,.3
Reach Compliance Code unknown unknown unknown unknown
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
frequency compensation YES YES YES YES
Maximum input offset voltage 5000 µV 9000 µV 9000 µV 9000 µV
JESD-30 code R-PDIP-T8 O-MBCY-W8 R-XDIP-T8 R-PDIP-T8
JESD-609 code e0 e0 e0 e0
low-dissonance NO NO NO NO
Number of functions 2 2 2 2
Number of terminals 8 8 8 8
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C
Package body material PLASTIC/EPOXY METAL CERAMIC PLASTIC/EPOXY
Encapsulate equivalent code DIP8,.3 CAN8,.2 DIP8,.3 DIP8,.3
Package shape RECTANGULAR ROUND RECTANGULAR RECTANGULAR
Package form IN-LINE CYLINDRICAL IN-LINE IN-LINE
power supply +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V +-1.5/+-15/3/30 V
technology BIPOLAR BIPOLAR BIPOLAR BIPOLAR
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form THROUGH-HOLE WIRE THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL BOTTOM DUAL DUAL
Maker Texas Instruments - Texas Instruments Texas Instruments
encapsulated code DIP - DIP DIP
surface mount NO - NO NO
Terminal pitch 2.54 mm - 2.54 mm 2.54 mm
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