IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | National Semiconductor（TI ） |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| Amplifier type | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK |
| frequency compensation | YES |
| Maximum input offset voltage | 5000 µV |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| low-dissonance | NO |
| Number of functions | 2 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | +-1.5/+-15/3/30 V |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| LM358AN/A+ | LM358H/A+ | LM358N/A+ | LM258AH | LM358J | |
|---|---|---|---|---|---|
| Description | IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC | IC,OP-AMP,DUAL,BIPOLAR,CAN,8PIN,METAL | IC,OP-AMP,DUAL,BIPOLAR,DIP,8PIN,PLASTIC | IC DUAL OP-AMP, 3000 uV OFFSET-MAX, 1 MHz BAND WIDTH, MBCY8, METAL CAN, TO-99, 8 PIN, Operational Amplifier | IC DUAL OP-AMP, 7000 uV OFFSET-MAX, 1 MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8, Operational Amplifier |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
| Architecture | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK | VOLTAGE-FEEDBACK |
| frequency compensation | YES | YES | YES | YES | YES |
| Maximum input offset voltage | 5000 µV | 9000 µV | 9000 µV | 3000 µV | 7000 µV |
| JESD-30 code | R-PDIP-T8 | O-MBCY-W8 | R-PDIP-T8 | O-MBCY-W8 | R-GDIP-T8 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 |
| low-dissonance | NO | NO | NO | NO | NO |
| Number of functions | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 8 | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | METAL | PLASTIC/EPOXY | METAL | CERAMIC, GLASS-SEALED |
| Encapsulate equivalent code | DIP8,.3 | CAN8,.2 | DIP8,.3 | CAN8,.2 | DIP8,.3 |
| Package shape | RECTANGULAR | ROUND | RECTANGULAR | ROUND | RECTANGULAR |
| Package form | IN-LINE | CYLINDRICAL | IN-LINE | CYLINDRICAL | IN-LINE |
| power supply | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V | +-1.5/+-15/3/30 V |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | OTHER | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | WIRE | THROUGH-HOLE | WIRE | THROUGH-HOLE |
| Terminal location | DUAL | BOTTOM | DUAL | BOTTOM | DUAL |
| Maker | National Semiconductor（TI ） | - | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） |
| package instruction | DIP, DIP8,.3 | - | DIP, DIP8,.3 | TO-99, CAN8,.2 | DIP, DIP8,.3 |
| encapsulated code | DIP | - | DIP | TO-99 | DIP |
| surface mount | NO | - | NO | NO | NO |
| Terminal pitch | 2.54 mm | - | 2.54 mm | - | 2.54 mm |
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