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AM29F010B-120DPK1

Description
Flash, 128KX8, 120ns, DIE-30
Categorystorage    storage   
File Size324KB,12 Pages
ManufacturerSPANSION
Websitehttp://www.spansion.com/
Environmental Compliance
Download Datasheet Parametric View All

AM29F010B-120DPK1 Overview

Flash, 128KX8, 120ns, DIE-30

AM29F010B-120DPK1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerSPANSION
Parts packaging codeDIE
package instructionDIE-30
Contacts30
Reach Compliance Codecompliant
ECCN code3A001.A.2.C
Maximum access time120 ns
JESD-30 codeR-XUUC-N30
JESD-609 codee3
memory density1048576 bit
Memory IC TypeFLASH
memory width8
Number of functions1
Number of terminals30
word count131072 words
character code128000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize128KX8
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeRECTANGULAR
Package formUNCASED CHIP
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Programming voltage5 V
Certification statusNot Qualified
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTIN
Terminal formNO LEAD
Terminal locationUPPER
Maximum time at peak reflow temperature40
typeNOR TYPE
Am29F010B Known Good Die
Data Sheet
(Retired Product)
Am29F010B Known Good Die Cover Sheet
This product has been retired and is not recommended for designs. Please contact your Spansion representative for
alternates. Availability of this document is retained for reference and historical purposes only.
The following document contains information on Spansion memory products.
Continuity of Specifications
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been
made are the result of normal data sheet improvement and are noted in the document revision summary.
For More Information
Please contact your local sales office for additional information about Spansion memory solutions.
Publication Number
23479
Revision
A
Amendment
3
Issue Date
March 2, 2009
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