|
LMH6609MAX/NOPB |
LMH6609MA/NOPB |
LMH6609MF/NOPB |
LMH6609MFX/NOPB |
| Description |
IC OP-AMP, 2500 uV OFFSET-MAX, PDSO8, SOIC-8, Operational Amplifier |
IC OP-AMP, 2500 uV OFFSET-MAX, PDSO8, SOIC-8, Operational Amplifier |
IC OP-AMP, 2500 uV OFFSET-MAX, PDSO5, SOT-23, 5-PIN, Operational Amplifier |
IC OP-AMP, 2500 uV OFFSET-MAX, PDSO5, SOT-23, 5-PIN, Operational Amplifier |
| Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
| Maker |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
National Semiconductor(TI ) |
| Parts packaging code |
SOIC |
SOIC |
SOT-23 |
SOT-23 |
| package instruction |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
LSSOP, TSOP5/6,.11,37 |
LSSOP, TSOP5/6,.11,37 |
| Contacts |
8 |
8 |
5 |
5 |
| Reach Compliance Code |
compliant |
compliant |
compliant |
compliant |
| ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
| Amplifier type |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
| Architecture |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
| Maximum average bias current (IIB) |
3 µA |
3 µA |
3 µA |
3 µA |
| Maximum bias current (IIB) at 25C |
5 µA |
5 µA |
5 µA |
5 µA |
| Nominal Common Mode Rejection Ratio |
75 dB |
75 dB |
75 dB |
75 dB |
| frequency compensation |
YES |
YES |
YES |
YES |
| Maximum input offset voltage |
2500 µV |
2500 µV |
2500 µV |
2500 µV |
| JESD-30 code |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G5 |
R-PDSO-G5 |
| JESD-609 code |
e3 |
e3 |
e3 |
e3 |
| length |
4.902 mm |
4.902 mm |
2.92 mm |
2.92 mm |
| low-bias |
NO |
NO |
NO |
NO |
| low-dissonance |
NO |
NO |
NO |
NO |
| micropower |
NO |
NO |
NO |
NO |
| Humidity sensitivity level |
1 |
1 |
1 |
1 |
| Negative supply voltage upper limit |
-6.6 V |
-6.6 V |
-6.6 V |
-6.6 V |
| Nominal Negative Supply Voltage (Vsup) |
-3.3 V |
-3.3 V |
-3.3 V |
-3.3 V |
| Number of functions |
1 |
1 |
1 |
1 |
| Number of terminals |
8 |
8 |
5 |
5 |
| Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
SOP |
SOP |
LSSOP |
LSSOP |
| Encapsulate equivalent code |
SOP8,.25 |
SOP8,.25 |
TSOP5/6,.11,37 |
TSOP5/6,.11,37 |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH |
| method of packing |
TAPE AND REEL |
RAIL |
RAIL |
TAPE AND REEL |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
| power |
NO |
NO |
NO |
NO |
| power supply |
+-3.3/+-5 V |
+-3.3/+-5 V |
+-3.3/+-5 V |
+-3.3/+-5 V |
| Programmable power |
NO |
NO |
NO |
NO |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| Maximum seat height |
1.753 mm |
1.753 mm |
1.22 mm |
1.22 mm |
| minimum slew rate |
1200 V/us |
1200 V/us |
1200 V/us |
1200 V/us |
| Nominal slew rate |
800 V/us |
800 V/us |
800 V/us |
800 V/us |
| Maximum slew rate |
8.5 mA |
8.5 mA |
8.5 mA |
8.5 mA |
| Supply voltage upper limit |
6.6 V |
6.6 V |
6.6 V |
6.6 V |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
YES |
YES |
| technology |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
| Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
| Terminal form |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
| Terminal pitch |
1.27 mm |
1.27 mm |
0.95 mm |
0.95 mm |
| Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
| Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
| Nominal Uniform Gain Bandwidth |
180000 kHz |
180000 kHz |
180000 kHz |
180000 kHz |
| broadband |
YES |
YES |
YES |
YES |
| width |
3.899 mm |
3.899 mm |
1.6 mm |
1.6 mm |