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Page 22
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
D
2
PAK, TO-220, SOT-223, SOL-20
Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a vari-
ety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increas-
ing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'
component thermal specifications.
FEATURES AND BENEFITS:
• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
Standard
P/N
Height Above
PC Board
in. (mm)
Footprint
Dimensions
in. (mm)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
.600 (15.2) x .740 (18.8)
Package
Format
Bulk
Tube
Tape & Reel
Package
Quantity
1
20
250
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
55°C @ 1W
55°C @ 1W
55°C @ 1W
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
16.0°C/W @ 200 LFM
217-36CTE6
.360 (9.1)
217-36CTTE6
.360 (9.1)
217-36CTRE6
.360 (9.1)
Material: Copper, Matte Tin Plated
MECHANICAL DIMENSIONS
217 HEAT SINK WITH
DDPAK DEVICE
THERMAL PERFORMANCE
6 LAYER BOARD, D' PAK
125°C LEAD, 40°C AMBIENT
217-36CT6
Device Tab dT, C
Device Power Dissipation. W
KEY:
í
Device only, NC
v
Device + HS, NC
Device + HS, 100 lfm
Device + HS, 200 lfm
Device + HS, 300 lfm
SECTION A-A
NOTES
1. Material to be “ESD”
2. Approximately 6 Meters per Reel
3. 250 Pieces per Reel.
217-36CTR6
TAPE DETAILS
REEL DETAILS
Dimensions: in.
22
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Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
217 SERIES
Surface Mount Heat Sinks
BOARD LAYOUT RECOMMENDATIONS
D
2
PAK, TO-220, SOL-20
MECHANICAL DIMENSIONS
217 SERIES
TUBE DETAILS
TUBE: 16.25 Inches Long,
Min. ESD Material with Nail
Stops
20 Pieces per Tube
217-36CTT6
SOL 20
REF: JEDEC TO-263 (DD PAK)
REF: JEDEC MO-169 (DD PAK)
217-36CT6
Dimensions: in.
218 SERIES
Surface Mount Heat Sink
Height Above
PC Board
in. (mm)
.40 (10.2)
.40 (10.2)
Maximum
Footprint
in. (mm)
.90 (22.9) x .315 (8.0)
1.03 (26.2) x .50 (12.7)
SMT Devices
Standard
P/N
218-40CTE3
218-40CTE5
Thermal Performance at Typical Load
Natural Convection
Forced Convection
62°C rise @ 2W
62°C rise @ 2W
21°C/W @ 200LFM
21°C/W @ 200LFM
Material: Copper, Matte Tin Plated
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
0
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
200
400
600
800
80
60
40
20
0
0
200
0.5
400
1.0
600
1.5
800
2.0
HEAT DISSIPATED (WATTS)
20
15
10
5
0
1000
2.5
218-40CT3
218-40CT5
Solid line = 218-40CT5
Dashed Line = 218-40CT3
THERMAL RESISTANCE SINK TO
AMBIENT (C)
100
1000
25
23
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Page 24
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
206 SERIES
Vertical Mount Heat Sink
Height Above
PC Board
in. (mm)
1.18 (30.0)
Maximum
Footprint
in. (mm)
1.00 (25.4) x .50 (12.7)
TO-220
Standard
P/N
206-1PABEH
Thermal Performance at Typical Load
Natural Convection
Forced Convection
56°C rise @ 4W
7.3°C/W @ 200LFM
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
0
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
200
400
600
800
100
80
60
40
20
0
0
200
2
400
4
600
6
800
8
HEAT DISSIPATED (WATTS)
8
6
4
2
0
1000
10
230 & 234 SERIES
Standard
P/N
Height Above
PC Board
in. (mm)
Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
Footprint
Dimensions
in. (mm)
Mounting
Configuation
Vert./Horiz.
Vertical
Horizontal
Vertical
Vert./Horiz
Vertical
Horizontal
Solderable
Tab
Option
No Tab
01
05
10
No Tab
01
05
Mounting
Style
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
THERMAL RESISTANCE SINK TO
AMBIENT (C)
1000
10
TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection)
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
57°C @ 2W
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
7.5°C/W @ 400 LFM
PATENT PENDING
230-75AB
.750 (19.1)
.570 (14.5) x .500 (12.7)
230-75ABE-01
.750 (19.1)
.570 (14.5) x .500 (12.7)
230-75ABE-05
.500 (12.7)
.750 (19.1) x .570 (14.5)
230-75ABE-10
.875 (22.2)
.570 (14.5) x .500 (12.7)
234-75AB
.790 (20.0)
.570 (14.5) x .500 (12.7)
234-75ABE-01
.790 (20.0)
.570 (14.5) x .500 (12.7)
234-75ABE-05
.500 (12.7)
.790 (20.0) x .570 (14.5)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
230-75AB-01
230-75AB-10
230 AND 234 SERIES
230-75AB-05
230 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
234 SERIES
234-75AB
234-75AB-01
234 SERIES
234-75AB-05
Dimensions: in. (mm)
24
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Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
241 SERIES
Horizontal Mount Heat Sink
TO-220
Standard
P/N
241-69ABE-03
Height Above
PC Board
in. (mm)
.39 (9.9)
Maximum
Footprint
in. (mm)
.86 (21.8) x .69 (17.5)
Thermal Performance at Typical Load
Natural Convection
Forced Convection
77°C rise @ 4W
12°C/W @ 200LFM
Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
AIR VELOCITY (LFM)
0
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
200
400
600
800
80
60
40
20
0
0
1
200
2
400
3
600
4
800
HEAT DISSIPATED (WATTS)
262 SERIES
Horizontal and Vertical Mount Heat Sink
Height Above
PC Board
in. (mm)
.53 (13.4)
.75 (19.1)
Maximum
Footprint
in. (mm)
.75 (19.1) x .50 (12.78)
.53 (13.4) x .50 (12.7)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
100
1000
20
18
16
14
12
10
8
6
4
2
0
5
1000
TO-220
Standard
P/N
262-75ABE-05
262-75ABE-01
Thermal Performance at Typical Load
Natural Convection
Forced Convection
80°C rise @ 2W
80°C rise @ 2W
10°C/W @ 200LFM
10°C/W @ 200LFM
Material: Aluminum, Black Anodized
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
AIR VELOCITY (LFM)
0
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
200
400
600
800
80
60
40
20
0
0
1
200
2
400
3
600
4
800
HEAT DISSIPATED (WATTS)
8
6
4
2
0
5
1000
THERMAL RESISTANCE SINK TO
AMBIENT (C)
100
1000
10
25
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Page 26
Board Level
Heat Sinks
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
233 & 236 SERIES
Standard
P/N
Height Above
PC Board
in. (mm)
Self-Locking Wavesolderable Heat Sinks
Footprint
Dimensions
in. (mm)
Mounting
Solderable
Configuration Tab Options
Vert./Horiz.
Vertical
Horizontal
Vertical
Vert./Horiz
Vertical
Horizontal
Vetrical
No Tab
01
05
10
No Tab
01
05
10
Mounting
Style
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
TO-220
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
58°C @ 2W
58°C @ 2W
58°C @ 2W
58°C @ 2W
40°C @ 2W
40°C @ 2W
40°C @ 2W
40°C @ 2W
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
11.0°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
4.80°C/W @ 400 LFM
PATENT PENDING
233-60AB
.600 (15.2) .570 (14.5) x .500 (12.7)
233-60ABE-01
.600 (15.2) .570 (14.5) x .500 (12.7)
233-60ABE-05
.500 (12.7) .600 (15.2) x .570 (14.5)
233-60ABE-10
.725 (18.4) .570 (14.5) x .500 (12.7)
236-150AB
1.500 (38.1) .570 (14.5) x .500 (12.7)
236-150ABE-01
1.500 (38.1) .570 (14.5) x .500 (12.7)
236-150ABE-05
.500 (12.7) 1.500 (38.1) x .570 (14.5)
236-150ABE-10
1.625 (41.3) .570 (14.5) x .570 (12.7)
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
233 AND 236 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
233-60AB-01
236-150AB-01
233-60AB-10
236-150AB-10
233-60AB-05
236-150AB-05
236-150AB
233-60AB
Dimensions: in. (mm)
275 & 231 SERIES
Standard
P/N
275-75AB
275-75ABE-01
275-75ABE-10
231-69PAB
231-69PABE
231-69PABE-XXX
231-75PAB
231-75PABE
231-75PABE-XXX
231-137PAB
231-137PABE
231-137PABE-XXX
Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks
Footprint
Dimensions
in. (mm)
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (14.5)
.835 (21.2) x .400 (12.7)
.690 (17.5) x .835 (12.7)
.835 (21.2) x .400 (12.7)
.835 (21.2) x .400 (14.5)
.750 (19.1) x .835 (12.7)
.835 (21.2) x .400 (12.7)
.835 (21.2 x .400 (12.7)
1.375 (34.9) x .835 (12.7)
.835 (21.2) x .400 (12.7)
TO-220
Height Above
PC Board
in. (mm)
.750 (19.1)
.750 (19.1)
.875 (12.7)
.690 (18.4)
.400 (10.1)
.690 (17.5)
.750 (19.1)
.400 (10.1)
.750 (19.1)
1.375 (35)
.400 (10.2)
1.375 (35)
Mounting
Solderable
Configuration Tab Options
Vert./Horiz.
Vertical
Vertical
Vert./Horiz.
Horizontal
Vertical
Vert./Horiz.
Horizontal
Vertical
Vert./Horiz.
Horizontal
Vertical
No Tab
01
10
No Tab
13H
13V, 14V, 15V
No Tab
13H
13V, 14V, 15V
No Tab
13H
13V, 14V, 15V
Mounting
Style
Thermal Performance at Typical Load
Natural
Forced
Convection
Convection
44 C @ 2W
44°C @ 2W
44°C @ 2W
45°C @ 2W
45°C @ 2W
45°C @ 2W
43°C @ 2W
43°C @ 2W
43°C @ 2W
32°C @ 2W
32°C @ 2W
32°C @ 2W
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
8°C/W @ 400 LFM
8°C/W @ 400 LFM
8°C/W @ 400 LFM
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
7.9°C/W @ 400 LFM
5.9°C/W @ 400 LFM
5.9°C/W @ 400 LFM
5.9°C/W @ 400 LFM
PATENT 5381041
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Clip/Mtg Hole
Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB)
MECHANICAL
DIMENSIONS
275 AND 231 SERIES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
TAB 13H
All versions No Tab
TAB
14V
TAB
13V
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
TAB 01
TAB 10
TAB 15V
TAB 13H
Dimensions: in. (mm)
26
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