Standard SRAM, 32KX9, 34ns, CMOS, PDIP32,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP32,.3 |
| Reach Compliance Code | compli |
| Maximum access time | 34 ns |
| I/O type | COMMON |
| JESD-30 code | R-PDIP-T32 |
| JESD-609 code | e0 |
| memory density | 294912 bi |
| Memory IC Type | STANDARD SRAM |
| memory width | 9 |
| Number of terminals | 32 |
| word count | 32768 words |
| character code | 32000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 32KX9 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP32,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.13 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.2 mA |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |

| PI2C2589-35P | PI2C2589-35J | |
|---|---|---|
| Description | Standard SRAM, 32KX9, 34ns, CMOS, PDIP32, | Standard SRAM, 32KX9, 34ns, CMOS, PDSO32, |
| Is it Rohs certified? | incompatible | incompatible |
| package instruction | DIP, DIP32,.3 | SOJ, SOJ32,.34 |
| Reach Compliance Code | compli | compli |
| Maximum access time | 34 ns | 34 ns |
| I/O type | COMMON | COMMON |
| JESD-30 code | R-PDIP-T32 | R-PDSO-J32 |
| JESD-609 code | e0 | e0 |
| memory density | 294912 bi | 294912 bi |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM |
| memory width | 9 | 9 |
| Number of terminals | 32 | 32 |
| word count | 32768 words | 32768 words |
| character code | 32000 | 32000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C |
| organize | 32KX9 | 32KX9 |
| Output characteristics | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOJ |
| Encapsulate equivalent code | DIP32,.3 | SOJ32,.34 |
| Package shape | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE |
| Parallel/Serial | PARALLEL | PARALLEL |
| power supply | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum standby current | 0.13 A | 0.13 A |
| Minimum standby current | 4.5 V | 4.5 V |
| Maximum slew rate | 0.2 mA | 0.2 mA |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | NO | YES |
| technology | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | J BEND |
| Terminal pitch | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL |
| Base Number Matches | 1 | 1 |