HMMC-3040
20 – 43 GHz Double-Balanced Mixer and
LO-Amplifier
Data Sheet
Chip Size:
Chip Size Tolerance:
Chip Thickness:
2520 x 730
µm
(99.2 x 28.7 mils)
±10 µm
(±0.4 mils)
127
±
15
µm
(5.0
±
0.6 mils)
Description
The HMMC-3040 is a broadband MMIC Double-Balanced
Mixer (DBM) with an integrated high-gain LO ampli-
fier. It can be used as either an up-converter or as a
down-converter in microwave/ millimeter-wave trans-
ceivers. If desired, the LO amplifier can be biased to
function as a frequency multiplier to enable harmonic
mixing of a LO source.
This three-port device has input and output match-
ing circuitry for use in 50 ohm environments. The
MMIC provides repeatable conversion loss (requiring
no tuning), thereby making it suitable for automated
assembly processes.
Features
• Both up and downconverting functions
• Harmonic LO mixing capability
• Large bandwidth:
RF port: 20 – 43 GHz
LO port match: DC – 43 GHz
LO amplifier: 20 – 43 GHz
IF port: DC – 5 GHz
• Repeatable conversion loss: 9.5 dB typical at 30 GHz
• Low LO drive required
• 50Ω port matching networks
Absolute Maximum Ratings
[1]
Symbol
V
D1,2
V
G1,2
I
DD
P
in
T
ch
T
A
T
st
T
max
Parameters/Conditions
Drain Supply Voltages
Gate Supply Voltages
Total Drain Current
RF Input Power
Channel Temperature
[2]
Backside Ambient Temperature
Storage Temperature
Max. Assembly Temperature
Units
V
V
mA
dBm
°C
°C
°C
°C
Min.
Max.
5
-3.0
0.5
400
21
160
-55
-65
+75
+165
300
Notes:
1. Absolute maximum ratings for continuous operation unless otherwise noted.
2. Refer to DC
Specifications/Physical Properties
table for deratinginformation.
Applications
The HMMC-3040 MMIC is a
broadband double-balanced
mixer (DBM) with an integrated
LO amplifier. It can be used as
either a frequency up-converter
or down-converter. This mixer
was designed specifically for
microwave/millimeter-wave
point-to-point and point-to-
multipoint (including LMDS/
LMCS/MVDS) communication
systems that operated in the
20–43 GHz frequency range.
The LO amplifier can also be
biased to provide frequency
multiplication of the LO source
(Figure 2). The integrated LO
amplifier will provide a good
impedance match to low
frequency input signals. Frequen-
cies below approximately 18 GHz
will not be passed by the LO
network, enhancing LO rejection.
Biasing and Operation
The recommended DC bias
condition is with all drains
connected to a single 3.5–4.5 volt
supply and all gates connected to
an adjustable negative voltage
supply. The gate voltage is
adjusted for a total drain supply
current of typically 150–230 mA.
An assembly diagram is shown in
Figure 4.
The LO amplifier has effectively
two gain stages as indicated in
Figure 1. One wire connection is
needed to each DC drain bias
supply pad, V
D1
and V
D2
, and one
to each DC gate bias pad, V
G1
and
V
G2
.
Harmonic LO mixing is possible
in some limited cases. The inte-
grated LO amplifier’s stages can
be individually biased to provide
optimum harmonic output. When
considering the HMMC-3040 as a
harmonic mixer, it is important
to realize that the integrated dou-
ble balanced mixer diodes need
~18 dBm (15 to 22 dBm) to
obtain optimum mixer conver-
sion. Avago product note #15,
“HMMC-3040 Multiplier
Operation” provides two
examples of harmonic mixing.
Also, Avago application note #50,
“HMMC-5040 As a 20 to 40 GHz
Multiplier” provides additional
information on multiplier opera-
tion and is a good reference
when considering the
HMMC-3040 as a harmonic
mixer; the HMMC-3040 inte-
grated LO amplifier is similar to
the HMMC-5040. No impedance
matching network is needed
because the LO port provides a
good match to signals having
frequency from DC to approxi-
mately 43 GHz.
The microwave/millimeter-wave
ports are not AC-coupled. A DC
blocking capacitor is required on
any RF port that may be exposed
to DC voltages.
No ground wires are needed be-
cause ground connections are
made with plated through-holes
to the backside of the device.
Assembly Techniques
It is recommended that the elec-
trical connections to the bonding
pads be made using 0.7-1.0 mil
diameter gold wire. The micro-
wave/millimeter-wave connec-
tions should be kept as short as
possible to minimize inductance.
For assemblies requiring long
bond wires, multiple wires can
be attached to the RF bonding
pads.
GaAs MMICs are ESD sensitive.
ESD preventive measures must
be employed in all aspects of
storage, handling, and assembly.
MMIC ESD precautions, handling
considerations, die attach and
bonding methods are critical fac-
tors in successful GaAs MMIC
performance and reliability.
Avago application note #54,
“GaAs MMIC ESD, Die Attach
and Bonding Guidelines” pro-
vides basic information on these
subjects.
Additional References
PN #15, “HMMC-5040 Multiplier
Operation,” and AN # 50,
“HMMC-5040 As a 20-40 GHz
Multiplier.”
DBM
IF
RF
IF
DBM
RF
V
D2
2
V
G2
V
D2
V
D1
V
G2
V
G1
V
D1
1
V
G1
LO
LO
Figure 1. HMMC-3040 Simplified Block
Diagram.
Figure 2. HMMC-3040 Harmonic Mixing Block
Diagram.
3
Additional HMMC-3040 Performance Characteristics
(Data refer to Figure 1)
12
13
12
11
V
DD
= 4.5 V, I
DD
= 230 mA
DOWN-CONVERSION LOSS (dB)
UP-CONVERSION LOSS (dB)
9
8
7
6
5
4
-20 -15 -10
IF = 3 GHz
LO = 25 GHz, 0 dBm
-5
0
5
10
15
20
11
10
9
8
7
-30
CONVERSION LOSS (dB)
V
DD
= 3.0 V, I
DD
= 150 mA
11 V
DD
= 3.5 V, I
DD
= 230 mA
V
DD
= 4.5 V, I
DD
= 230 mA
10
V
DD
= 3.0 V, I
DD
= 150 mA
V
DD
= 3.5 V, I
DD
= 230 mA
12 V
DD
= 4.5 V, I
DD
= 230 mA
10
9
8
7
6
-12
RF = 28 GHz, 0 dBm
LO = 25 GHz, 0 dBm
-8
-4
0
4
8
-20
-10
0
10
20
IF-INPUT POWER (dBm)
RF-INPUT POWER (dBm)
LO INPUT POWER (dBm)
Figure 5. Up-Conversion Loss vs. IF Input
Power for Various LO Amplifier Bias
Conditions.
12
11
I
DD
= 150 mA
I
DD
= 230 mA
I
DD
= 290 mA
Figure 6. Down-Conversion Loss vs. RF Input
Power.
Figure 7. Conversion Loss vs. LO Input Power.
CONVERSION LOSS (dB)
10
9
8
7
6
5
4
2
RF = 28 GHz, 0 dBm
LO = 25 GHz, 0 dBm
2.5
3
3.5
V
DD
(Volt)
4
4.5
5
Figure 8. Conversion Loss vs. V
DD
for Various
LO Amplifier Drain Currents.
Note:
All data measured on individual devices
mounted in a 50 GHz test package T
A
= 25°C
and under Figure 1 condition (except where
noted).
This data sheet contains a variety of typical and guaranteed performance data. The information supplied should
not be interpreted as a complete list of circuit specifications. In this data sheet the term
typical
refers to the 50th
percentile performance. For additional information contact your local Avago Technologies’ sales representative.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited
in the United States and other countries.
Data subject to change. Copyright © 2006 Avago Technologies, Limited. All rights reserved.
Obsoletes 5988-1906EN
5988-6895EN September 16, 2006
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