F-213
MLE–150–01–G–DV
MLE–120–01–G–DV
TM
CLM–126–02–F–D
EXTENDED LIFE PRODUCT
CLM–111–02–L–D
(1,00 mm) .0394"
CLM, MLE SERIES
10 year Mixed Flowing Gas with 30µ" Gold
Call Samtec for maximum cycles
RUGGED RELIABLE MICRO SOCKETS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?CLM
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au, Sn or SnPb
over 50µ" (1,27 µm) Ni
Current Rating:
3A per contact
@ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Contact Resistance:
15 mΩ
Insertion Depth:
Top Entry = (1,40 mm) .055"
min., Bottom Entry = (2,41 mm)
.095" min. (Add board
thickness for correct post OAL)
Insertion Force:
1.5 oz (0,42 N) average
Normal Force:
40 grams (0,39 N) average
Withdrawal Force:
.75 oz (0,21 N) average
Max Cycles:
100 with 10µ" (0,25 µm) Au
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-25)
(0,15 mm) .006" max (26-50)
CLM
Mates with:
FTM, FTMH, MW
1
NO. PINS
PER ROW
02
PLATING
OPTION
D
OPTIONS
–F
02 thru 50
= Gold flash on
contact,
Matte Tin on tail
–BE
= Bottom Entry
(Required for bottom entry)
–L
(1,00)
.03937
No. of positions x (1,00) .03937
+ (0,318) .0125
(5,72)
.225
x
(3,57)
.140
(2,54)
.100
(1,00)
.03937
(2,12)
.084
(0,28)
.011
01
= 10µ" (0,25 µm)
Gold on contact,
Matte Tin on tail
(2,41)
.095
–K
= (3,50 mm) .138" DIA
Polyimide film Pick & Place Pad
(7 positions minimum)
100
02
–P
= Pick & Place Pad
(7 positions minimum)
(8,26) .325
by
A
–P
(3,81)
.150
(2,26)
.089
(1,36)
.054
–PA
(3,00)
.118
= Pick & Place Pad with
integral Alignment Pin
APPLICATION
Note:
Some
lengths, styles
and options are
non-standard,
non-returnable.
PIN/ROW
04-15
16-50
A
(3,56)
.140
(7,11)
.280
(0,89) .035
DIA
(7,00)
.275
–TR
= Tape & Reel Packaging
–PA
APPLICATION
SPECIFIC OPTION
• Alignment Pin available.
• Other Gold plating options available.
Call Samtec.
Pass-Thru
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?MLE
Insulator Material:
Black LCP
Contact Material:
BeCu
Operating Temp Range:
-55°C to +125°C
Plating:
Au over 10µ" (0,25 µm) Ni
Insertion Depth:
(1,63 mm) .064" to (3,18 mm)
.125" with (0,38 mm) .015"
wipe, pass-through, or
(2,44 mm) .096" minimum
for bottom entry
Insertion Force:
2.70 oz (0,75 N) average
Withdrawal Force:
0.50 oz (0,14 N) average
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0,10 mm) .004" max (02-25)
(0,15 mm) .006" max (26-50)
Note:
Some lengths, styles
and options are non-standard,
non-returnable.
MLE
Mates with:
FTM, FTMH, MW
1
NO. PINS
PER ROW
01
PLATING
OPTION
DV
OPTIONS
–G
02 thru 50
= 10µ"
(0,25 µm)
Gold
–A
= Alignment Pin
(3 positions minimum)
Metal or plastic at Samtec
discretion.
(0,71)
.028
No. of positions
x (1,00) .03937 + (0,20) .008
(0,64)
.025
DIA
(3,07)
.121
(1,00)
.03937
(3,12)
.123
(0,30)
.012
01
–K
= (4,00 mm) .1575" DIA
Polyimide film Pick & Place Pad
(5 positions minimum)
(1,00)
100
.03937
02
–A
(6,35)
.250
x
(3,18)
.125
(3,50)
.138
–P
= Metal Pick & Place Pad
(5 positions minimum)
(4,32)
.170
(3,30)
.130
–TR
= Tape & Reel Packaging
–P
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