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IS62WV10248DBLL-45MI

Description
Standard SRAM, 1MX8, 45ns, CMOS, PBGA48, 9 X 11 MM, MINI, BGA-48
Categorystorage    storage   
File Size457KB,15 Pages
ManufacturerIntegrated Silicon Solution ( ISSI )
Download Datasheet Parametric Compare View All

IS62WV10248DBLL-45MI Overview

Standard SRAM, 1MX8, 45ns, CMOS, PBGA48, 9 X 11 MM, MINI, BGA-48

IS62WV10248DBLL-45MI Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerIntegrated Silicon Solution ( ISSI )
Parts packaging codeBGA
package instructionTFBGA,
Contacts48
Reach Compliance Codecompliant
ECCN code3A991.B.2.A
Maximum access time45 ns
JESD-30 codeR-PBGA-B48
JESD-609 codee0
length11 mm
memory density8388608 bit
Memory IC TypeSTANDARD SRAM
memory width8
Humidity sensitivity level3
Number of functions1
Number of terminals48
word count1048576 words
character code1000000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1MX8
Package body materialPLASTIC/EPOXY
encapsulated codeTFBGA
Package shapeRECTANGULAR
Package formGRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Certification statusNot Qualified
Maximum seat height1.2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)2.4 V
Nominal supply voltage (Vsup)3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBALL
Terminal pitch0.75 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width9 mm
IS62WV10248DALL/BLL
IS65WV10248DALL/BLL
1M x 8 LOW VOLTAGE,
ULTRA LOW POWER CMOS STATIC RAM
FEATURES
• High-speed access time: 45ns, 55ns
• CMOS low power operation
– 36 mW (typical) operating
– 12 µW (typical) CMOS standby
• TTL compatible interface levels
• Single power supply
– 1.65V--2.2V V
dd
(62/65WV10248dALL)
– 2.4V--3.6V V
dd
(62/65WV10248dBLL)
• Fully static operation: no clock or refresh
required
• Three state outputs
• Data control for upper and lower bytes
• Automotive temperature (-40
o
C to +125
o
C)
• Lead-free available
PRELIMINARY INFORMATION
MARCH 2009
high-speed, 8M bit static RAMs organized as 1M words
by 8 bits. It is fabricated using
ISSI
's high-performance
CMOS technology. This highly reliable process coupled
with innovative circuit design techniques, yields high-
performance and low power consumption devices.
When
CS1
is HIGH (deselected) or when CS2 is LOW
(deselected), the device assumes a standby mode at
which the power dissipation can be reduced down with
CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs. The active LOW Write Enable
(WE)
controls both writing and reading of the memory.
The IS62WV10248DALL and IS62WV10248DBLL are
packaged in the JEDEC standard 48-pin mini BGA (9mm
x 11mm) and
44-Pin TSOP (TYPE II).
DESCRIPTION
The
ISSI
IS62WV10248DALL/ IS62WV10248DBLL are
FUNCTIONAL BLOCK DIAGRAM
A0-A19
DECODER
1M x 8
MEMORY ARRAY
V
DD
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CS2
CS1
OE
WE
CONTROL
CIRCUIT
Copyright © 2005 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no
liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on
any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com —
1-800-379-4774
Rev. 00B
03/04/09
1

IS62WV10248DBLL-45MI Related Products

IS62WV10248DBLL-45MI IS62WV10248DBLL-45MLI IS62WV10248DBLL-45TLI IS62WV10248DBLL-45TI
Description Standard SRAM, 1MX8, 45ns, CMOS, PBGA48, 9 X 11 MM, MINI, BGA-48 Standard SRAM, 1MX8, 45ns, CMOS, PBGA48, 9 X 11 MM, LEAD FREE, MINI, BGA-48 Standard SRAM, 1MX8, 45ns, CMOS, PDSO44, LEAD FREE, TSOP2-44 1MX8 STANDARD SRAM, 45ns, PDSO44, TSOP2-44
Is it lead-free? Contains lead Lead free Lead free Contains lead
Is it Rohs certified? incompatible conform to conform to incompatible
Maker Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )
Parts packaging code BGA BGA TSOP2 TSOP2
package instruction TFBGA, TFBGA, TSOP2, TSOP2-44
Contacts 48 48 44 44
Reach Compliance Code compliant compliant compliant compliant
ECCN code 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
Maximum access time 45 ns 45 ns 45 ns 45 ns
JESD-30 code R-PBGA-B48 R-PBGA-B48 R-PDSO-G44 R-PDSO-G44
JESD-609 code e0 e1 e3 e0
length 11 mm 11 mm 18.41 mm 18.41 mm
memory density 8388608 bit 8388608 bit 8388608 bit 8388608 bit
Memory IC Type STANDARD SRAM STANDARD SRAM STANDARD SRAM STANDARD SRAM
memory width 8 8 8 8
Humidity sensitivity level 3 3 3 3
Number of functions 1 1 1 1
Number of terminals 48 48 44 44
word count 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 1MX8 1MX8 1MX8 1MX8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TFBGA TFBGA TSOP2 TSOP2
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 260 NOT SPECIFIED
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 2.4 V 2.4 V 2.4 V 2.4 V
Nominal supply voltage (Vsup) 3 V 3 V 3 V 3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Silver/Copper (Sn/Ag/Cu) Matte Tin (Sn) - annealed Tin/Lead (Sn/Pb)
Terminal form BALL BALL GULL WING GULL WING
Terminal pitch 0.75 mm 0.75 mm 0.8 mm 0.8 mm
Terminal location BOTTOM BOTTOM DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED 10 10 NOT SPECIFIED
width 9 mm 9 mm 10.16 mm 10.16 mm

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