MMBD1201 / 1203 / 1204 / 1205
MMBD1201 / 1203 / 1204 / 1205
CONNECTION DIAGRAMS
3
1201
3
3
1203
3
24
1
2 NC
3
1
3
2
2
1
2
1204
1205
SOT-23
1
MARKING
MMBD1201 24
MMBD1204A 27
MMBD1203 26
MMBD1205A 28
1
2
1
2
High Conductance Ultra Fast Diode
Sourced from Process 1P.
Absolute Maximum Ratings*
Symbol
W
IV
I
F(AV)
I
FM
I
FRM
I
FSM
T
stg
T
J
Working Inverse Voltage
Average Rectified Current
DC Forward Current
Recurrent Peak Forward Current
TA = 25°C unless otherwise noted
Parameter
Value
50
200
600
700
1.0
2.0
-55 to +150
150
Units
V
mA
mA
mA
A
A
°C
°C
Non-repetitive Peak Forward Surge Current
Pulse width = 1.0 second
Pulse width = 1.0 microsecond
Storage Temperature Range
Operating Junction Temperature
*
These ratings are limiting values above which the serviceability of any semiconductor device may be impaired.
NOTES:
1)
These ratings are based on a maximum junction temperature of 150 degrees C.
2)
These are steady state limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.
Thermal Characteristics
Symbol
P
D
R
θJA
TA = 25°C unless otherwise noted
Parameter
Total Device Dissipation
Derate above 25°C
Thermal Resistance, Junction to Ambient
Max
MMBD1201/1203/1204/1205*
350
2.8
357
Units
mW
mW/°C
°C/W
*
Device mounted on glass epoxy PCB 1.6" X 1.6" X 0.06"; mounting pad for the collector lead min. 0.93 in2
2001
Fairchild Semiconductor Corporation
MMBD1200 series, Rev. A1
MMBD1201 / 1203 / 1204 / 1205
High Conductance Ultra Fast Diode
(continued)
Electrical Characteristics
Symbol
V
R
I
RM
V
FM
TA = 25°C unless otherwise noted
Parameter
Breakdown Voltage
Maximum Instantaneous Reverse
Current
Maximum Instantaneous Forward
Voltage
Test Conditions
I
R
= 100
µA
V
R
= 20 V
V
R
= 50 V
V
R
= 50 V, T
A
= 150°C
I
F
= 1.0 mA
I
F
= 10 mA
I
F
= 100 mA
I
F
= 200 mA
I
F
= 300 mA
V
R
= 0, f = 1.0 MHz
I
RR
= 1.0 mA, I
F
= I
R
= 10 mA,
R
L
= 100Ω
Min
100
Max
25
50
5.0
600
740
920
1.0
1.1
2.0
4.0
Units
V
nA
nA
µA
mV
mV
mV
V
V
pF
ns
550
660
820
0.87
C
T
t
rr
Diode Capacitance
Reverse Recovery Time
Typical Characteristics
V
R
V
R
- REVERSE VOLTAGE (V)
150
140
130
120
110
I
R
- REVERSE CURRENT (nA)
REVERSE VOLTAGE vs REVERSE CURRENT
BV - 1.0 to 100 uA
Ta= 25°C
REVERSE CURRENT vs REVERSE VOLTAGE
IR - 10 to 100 V
300
Ta= 25°C
250
200
150
100
50
0
10
20
30
50
V
R
- REVERSE VOLTAGE (V)
70
100
1
2
3
5
10
20 30
50
I
R
- REVERSE CURRENT (uA)
100
GENERAL RULE: The Reverse Current of a diode will approximately
double for every ten (10) Degree C increase in Temperature
FORWARD VOLTAGE vs FORWARD CURRENT
VF - 1.0 to 100 uA
V
F
V
F
- FORWARD VOLTAGE (mV)
V
V
F
F
- FORWARD VOLTAGE (mV)
485
Ta= 25°C
450
400
350
300
250
225
FORWARD VOLTAGE vs FORWARD CURRENT
VF - 0.1 to 10 mA
725
Ta= 25°C
700
650
600
550
500
450
0.1
0.2 0.3 0.5
1
2
3
5
I
F
- FORWARD CURRENT (mA)
10
1
2
5
10
20 30
50
I
F
- FORWARD CURRENT (uA)
3
100
MMBD1200 series, Rev. A1
MMBD1201 / 1203 / 1204 / 1205
High Conductance Ultra Fast Diode
(continued)
Typical Characteristics
(continued)
FORWARD VOLTAGE vs FORWARD CURRENT
VF - 10 - 800 mA
V
V
F
- FORWARD VOLTAGE (V)
F
1.5
CAPACITANCE vs REVERSE VOLTAGE
VR - 0.0 to 15 V
1.3
CAPACITANCE (pF)
Ta= 25°C
1.4
1.2
1
0.8
Ta= 25°C
1.2
1.1
0.6
10
20
30
50
100
200 300
I
F
- FORWARD CURRENT (mA)
500
1
0
2
4
6
8
10
REVERSE VOLTAGE (V)
12
14 15
REVERSE RECOVERY TIME vs REVERSE CURRENT
TRR - IR 10 mA vs 60 mA
REVERSE RECOVERY (nS)
4
3.5
3
2.5
2
1.5
1
10
20
30
40
50
REVERSE CURRENT (mA)
60
P
D
- POWER DISSIPATION (mW)
Ta= 25°C
Average Rectified Current (Io) &
Forward Current (I
F
) versus
Ambient Temperature (T
A
)
500
400
300
200
100
0
I
R
-F
OR
WA
R
D
CU
RR
EN
T
Io - A
ST
VER
AT
AGE
E
REC
-m
TIFIE
D CU
A
RRE
NT -
mA
ST
EA
DY
IRR (Reverse Recovery Current) = 1.0 mA - Rloop = 100 Ohms
0
50
100
150
T
A
- AMBIENT TEMPERATURE (
o
C)
POWER DERATING CURVE
500
P
D
- POWER DISSIPATION (mW)
P
D
400
300
200
100
0
DO-35 Pkg
SOT-23 Pkg
0
50
100
150
I
O
- AVERAGE TEMPERATURE (
o
C)
200
MMBD1200 series, Rev. A1
SOT-23 Tape and Reel Data
SOT-23 Packaging
Configuration:
Figure 1.
0
Customized La
bel
Packaging Description:
SOT-23 parts are shipped in tape. The carrier tape is
made from a dissipative (carbon filled) polycarbonate
resin. The cover tape is a m
ultilayer film (Heat Activated
Adhesive in na
ture) primarily composed of polyester film,
adhesive layer, sealan and an
t,
ti-static sprayed agent.
These reeled pa in stan rd option are shippe with
rts
da
d
3,000 units per 7" or 177cm diameter reel. The reels are
dark blue in color an is made of polystyrene plastic (anti-
d
static coated Othe option comes in 10,000 units per 13"
).
r
or 330cm diameter reel. This and s
ome other options are
describe in the P
d
ackaging Information table.
These full reels are individua labele an placed inside
lly
d d
a s
tanda intermediate made of recyclable corrugated
rd
brown pap with a Fairchil d logo printing. One pizza box
er
contains eight reels maximum. And thes intermed
e
iate
boxes are placed inside a labeled shipping box which
comes in different sizes depending on t e nu
h
mber of parts
shippe
d.
Antistatic Cover Tape
Human Readable
Label
Embossed
Carrier Tape
3P
SOT-23 Packaging Information
Packaging Option
Packaging type
Qty per Reel/Tube/Bag
Reel Size
Box Dimension (mm)
Max qty per Box
Weight per unit (gm)
Weight per Reel (kg)
Note/Comments
Standard
(no flow code
)
TNR
3,000
7" Dia
187x107x183
24,000
0.0082
0.1175
D87Z
TNR
10,000
13"
343x343x64
30,000
0.0082
0.4006
3P
3P
3P
SOT-23 Unit Orientation
343mm x 342mm x 64mm
Intermediate box for L87Z Option
Human Readable Label
Human Readable Label sample
H uman readable
Label
SOT-23 Tape Leader and Trailer
Configuration:
Figure 2.
0
187mm x 107mm x 183mm
Intermediate Box for Stand Option
ard
Carrier Tape
Cover Tape
Components
Trailer Tape
300mm minimum or
75 empt y poc kets
Leader Tape
500mm minimum or
125 empty pockets
©2000 Fairchild Semiconductor International
September 1999, Rev. C
SOT-23 Tape and Reel Data, continued
SOT-23 Embossed Carrier Tape
Configuration:
Figure 3.0
P0
T
E1
P2
D0
D1
F
E2
B0
Wc
W
Tc
K0
P1
A0
User Direction of Feed
Dimensions are in millimeter
Pkg type
SOT-23
(8mm)
A0
3.15
+/-0.10
B0
2.77
+/-0.10
W
8.0
+/-0.3
D0
1.55
+/-0.05
D1
1.125
+/-0.125
E1
1.75
+/-0.10
E2
6.25
min
F
3.50
+/-0.05
P1
4.0
+/-0.1
P0
4.0
+/-0.1
K0
1.30
+/-0.10
T
0.228
+/-0.013
Wc
5.2
+/-0.3
Tc
0.06
+/-0.02
Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C).
20 deg maximum
Typical
component
cavity
center line
0.5mm
maximum
B0
20 deg maximum component rotation
0.5mm
maximum
Sketch A (Side or Front Sectional View)
Component Rotation
A0
Sketch B (Top View)
Typical
component
center line
Sketch C (Top View)
Component lateral movement
SOT-23 Reel Configuration:
Figure 4.0
Component Rotation
W1 Measured at Hub
Dim A
Max
Dim A
max
Dim N
See detail AA
7" Diameter Option
B Min
Dim C
See detail AA
W3
Dim D
min
13" Diameter Option
W2 max Measured at Hub
DETAIL AA
Dimensions are in inches and millimeters
Tape Size
8mm
Reel
Option
7" Dia
Dim A
7.00
177.8
13.00
330
Dim B
0.059
1.5
0.059
1.5
Dim C
512 +0.020/-0.008
13 +0.5/-0.2
512 +0.020/-0.008
13 +0.5/-0.2
Dim D
0.795
20.2
0.795
20.2
Dim N
2.165
55
4.00
100
Dim W1
0.331 +0.059/-0.000
8.4 +1.5/0
0.331 +0.059/-0.000
8.4 +1.5/0
Dim W2
0.567
14.4
0.567
14.4
Dim W3 (LSL-USL)
0.311 – 0.429
7.9 – 10.9
0.311 – 0.429
7.9 – 10.9
8mm
13" Dia
September 1999, Rev. C
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