FIFO, 1KX9, 65ns, Asynchronous, CMOS, CDFP28, CERAMIC, FP-28
| Parameter Name | Attribute value |
| Maker | Cypress Semiconductor |
| Parts packaging code | DFP |
| package instruction | DFP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 65 ns |
| Other features | RETRANSMIT |
| period time | 80 ns |
| JESD-30 code | R-GDFP-F28 |
| memory density | 9216 bit |
| memory width | 9 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 1KX9 |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal location | DUAL |
| 5962-9158503MZX | 5962-9158506MZX | 5962-9158505MZX | |
|---|---|---|---|
| Description | FIFO, 1KX9, 65ns, Asynchronous, CMOS, CDFP28, CERAMIC, FP-28 | FIFO, 1KX9, 30ns, Asynchronous, CMOS, CDFP28, CERAMIC, FP-28 | FIFO, 1KX9, 40ns, Asynchronous, CMOS, CDFP28, CERAMIC, FP-28 |
| Parts packaging code | DFP | DFP | DFP |
| package instruction | DFP, | DFP, | DFP, |
| Contacts | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown |
| ECCN code | EAR99 | EAR99 | EAR99 |
| Maximum access time | 65 ns | 30 ns | 40 ns |
| Other features | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| period time | 80 ns | 40 ns | 50 ns |
| JESD-30 code | R-GDFP-F28 | R-GDFP-F28 | R-GDFP-F28 |
| memory density | 9216 bit | 9216 bit | 9216 bit |
| memory width | 9 | 9 | 9 |
| Number of functions | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 |
| word count | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| organize | 1KX9 | 1KX9 | 1KX9 |
| Exportable | NO | NO | NO |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | DFP | DFP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Filter level | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal form | FLAT | FLAT | FLAT |
| Terminal location | DUAL | DUAL | DUAL |
| Maker | Cypress Semiconductor | - | Cypress Semiconductor |
| Base Number Matches | - | 1 | 1 |
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