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HCS259-29GG

Description
IC Socket, PGA259, 259 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,
CategoryThe connector    socket   
File Size261KB,2 Pages
ManufacturerAdvanced Interconnections Corp.
Download Datasheet Parametric View All

HCS259-29GG Overview

IC Socket, PGA259, 259 Contact(s), 2.54mm Term Pitch, 0.1inch Row Spacing, Solder,

HCS259-29GG Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAdvanced Interconnections Corp.
Reach Compliance Codenot_compliant
ECCN codeEAR99
Other features2.5 OZ. AVG. INSERTION FORCE
body width1.8 inch
subject depth0.165 inch
body length1.8 inch
Contact structure18X18
Contact to complete cooperationAU ON NI
Contact completed and terminatedGold (Au) - with Nickel (Ni) barrier
Contact materialBE-CU
Contact styleRND PIN-SKT
Device slot typeIC SOCKET
Type of equipment usedPGA259
Shell materialGLASS FILLED THERMOPLASTIC
JESD-609 codee4
Manufacturer's serial numberHCS
Plug contact pitch0.1 inch
Installation methodSTRAIGHT
Number of contacts259
Maximum operating temperature260 °C
Minimum operating temperature-60 °C
PCB contact patternRECTANGULAR
PCB contact row spacing0.1 mm
Terminal pitch2.54 mm
Termination typeSOLDER
PGA Sockets
Table of Models
Low Insertion Force PGA Sockets
.100/(2.54mm) Standard Grid
Description:
Peel-A-Way
®
(KIS)
Material: Polyimide Film
Index: -269°C to 400°C (-452°F to 752°F)
Description:
FR-4 (FIS)
Material: FR-4 Fiberglass Epoxy Board
Index: -40°C to 140°C (-40°F to 284°F)
Features:
• Low insertion force (1 oz. average
per pin).
• Screw-machined terminals with
multiple finger contacts for
reliability.
• Closed bottom terminal for 100%
anti-wicking of solder.
• Tapered entry for ease of
insertion.
• Custom designs available.
Description:
Molded (RIS)
Mat’l: High Temp. Liquid Crystal Polymer (LCP)
Index: -40°C to 260°C (-40°F to 500°F)
RIS replaces HCIS, HCS, CIS, and CS.
?
?
.005
(.13)
PC Board
PC Board
Polyimide
Film
.062
(1.57)
.095
(2.41)
Options
Tape Seal - add 3M to end of part number
• Removable tape seal protects plated contact in harsh environments
• Sealed socket will not allow dirt and other contaminants to enter
socket chamber and become entrapped behind contact fingers
• Spray flux without contaminating contact area
Specifications:
Terminals:
Brass - Copper Alloy
(C36000) ASTM-B-16
Contacts:
Beryllium Copper
(C17200) ASTM-B-194
Solder Preform:
Standard: 63Sn/37Pb
Lead-free: 95.5Sn/4.0Ag/0.5Cu
Plating:
G - Gold over Nickel
M - Matte Tin over Nickel
T - Tin/Lead over Nickel
Gold per ASTM-B-488
Matte Tin per ASTM545-97
Tin/Lead per MIL-P-81728
Nickel per QQ-N-290
Material
Silicone Backed Polyimide Film, -74°C to 260°C (-100°F to 500°F)
Intermittent to 371°C (700°F)
How To Order
1 RIS
Footprint Dash #
If Applicable
*
Body Type
RoHS Compliant Insulators:
KIS - Peel-A-Way
®
068 - 04 M G
Contact Plating
RoHS Compliant:
G - Gold
T - Tin/Lead
Terminal Plating
RoHS Compliant:
FIS - FR-4
RIS - Hi-Temp Molded LCP
Number of Pins
004 to 484
*Footprints available online
G - Gold
M - Matte Tin
T - Tin/Lead
Terminal Type
See options on next page
Note: Terminals plated with Matte Tin are available only with Gold plated contacts.
Quick-Turn delivery is not available on products with Matte Tin plating.
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Catalog 16
rev. Sept. 07
1 ESX 503 - 234
Footprint Dash #
Body Type
M
G
RoHS Compliant:
Contact Plating
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
If Applicable
*
inch/(mm)
G - Gold
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