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IRKV105/16P

Description
Silicon Controlled Rectifier, 165A I(T)RMS, 105000mA I(T), 1600V V(DRM), 1600V V(RRM), 2 Element, ADD-A-PAK-7
CategoryAnalog mixed-signal IC    Trigger device   
File Size201KB,9 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

IRKV105/16P Overview

Silicon Controlled Rectifier, 165A I(T)RMS, 105000mA I(T), 1600V V(DRM), 1600V V(RRM), 2 Element, ADD-A-PAK-7

IRKV105/16P Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerVishay
Parts packaging codeTO-240
package instructionFLANGE MOUNT, R-XUFM-X7
Contacts7
Manufacturer packaging codeADD-A-PAK
Reach Compliance Codeunknown
Shell connectionISOLATED
ConfigurationSERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Maximum DC gate trigger current150 mA
Maximum DC gate trigger voltage4 V
Quick connection description2G-2GR
Description of screw terminals2K-CA
Maximum holding current200 mA
JESD-30 codeR-XUFM-X7
Maximum leakage current20 mA
On-state non-repetitive peak current2100 A
Number of components2
Number of terminals7
Maximum on-state current105000 A
Maximum operating temperature130 °C
Minimum operating temperature-40 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formFLANGE MOUNT
Certification statusNot Qualified
Maximum rms on-state current165 A
Off-state repetitive peak voltage1600 V
Repeated peak reverse voltage1600 V
surface mountNO
Terminal formUNSPECIFIED
Terminal locationUPPER
Trigger device typeSCR
Bulletin I27298 01/07
IRKU/V105..PbF SERIES
THYRISTOR/ THYRISTOR
Features
High Voltage
Industrial Standard Package
Thick Al metal die and double stick bonding
Thick copper baseplate
UL E78996 approved
3500V
RMS
isolating voltage
TOTALLY LEAD-FREE
ADD-A-pak
TM
GEN V Power Modules
Benefits
Up to 1600V
Full compatible TO-240AA
High Surge capability
Easy Mounting on heatsink
Al
2
0
3
DBC insulator
Heatsink grounded
105 A
Mechanical Description
The Generation V of Add-A-pak module combine the
excellent thermal performance obtained by the usage
of Direct Bonded Copper substrate with superior me-
chanical ruggedness, thanks to the insertion of a solid
Copper baseplate at the bottom side of the device.
The Cu baseplate allow an easier mounting on the
majority of heatsink with increased tolerance of sur-
face roughness and improve thermal spread.
The Generation V of AAP module is manufactured
without hard mold, eliminating in this way any possible
direct stress on the leads.
The electrical terminals are secured against axial pull-
out: they are fixed to the module housing via a click-stop
feature already tested and proved as reliable on other IR
modules.
Electrical Description
These modules are intended for general purpose high
voltage applications such as high voltage regulated
power supplies, lighting circuits, temperature and motor
speed control circuits, UPS and battery charger.
Major Ratings and Characteristics
Parameters
I
T(AV)
@ 85°C
I
T(RMS)
I
TSM
@ 50Hz
@ 60Hz
I
2
t
@ 50Hz
@ 60Hz
I
2
√t
V
RRM
range
T
STG
T
J
Values
105
165
1785
1870
15.91
14.52
159.1
400 to 1600
- 40 to 125
- 40 to130
Units
A
A
A
A
KA
2
s
KA
2
s
KA
2
√s
V
o
C
C
o
Document Number: 94481
www.vishay.com
1

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