Microcontroller, 4-Bit, MROM, 1MHz, CMOS, PDIP22, DIP-22
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | ROHM Semiconductor |
| Parts packaging code | DIP |
| package instruction | DIP, DIP22,.3 |
| Contacts | 22 |
| Reach Compliance Code | unknown |
| Has ADC | NO |
| Address bus width | |
| bit size | 4 |
| maximum clock frequency | 1 MHz |
| DAC channel | NO |
| DMA channel | NO |
| External data bus width | |
| JESD-30 code | R-PDIP-T22 |
| JESD-609 code | e0 |
| length | 26.3 mm |
| Number of I/O lines | 17 |
| Number of terminals | 22 |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | -25 °C |
| PWM channel | NO |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP22,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 3 V |
| Certification status | Not Qualified |
| RAM (bytes) | 16 |
| rom(word) | 1024 |
| ROM programmability | MROM |
| Maximum seat height | 4.45 mm |
| speed | 1 MHz |
| Maximum slew rate | 1 mA |
| Maximum supply voltage | 4 V |
| Minimum supply voltage | 2 V |
| Nominal supply voltage | 3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER |

| BU2459 | BU2456 | BU2458 | BU2460 | BU2461 | BU2462 | |
|---|---|---|---|---|---|---|
| Description | Microcontroller, 4-Bit, MROM, 1MHz, CMOS, PDIP22, DIP-22 | Microcontroller, 4-Bit, MROM, 1MHz, CMOS, PDSO24, SSOP-24 | Microcontroller, 4-Bit, MROM, 1MHz, CMOS, PDSO22, SOP-22 | Microcontroller, 4-Bit, MROM, 1MHz, CMOS, PDIP22, SDIP-22 | Microcontroller, 4-Bit, MROM, 1MHz, CMOS, PDSO20, SOP-20 | Microcontroller, 4-Bit, MROM, 1MHz, CMOS, PDIP20, DIP-20 |
| Is it Rohs certified? | incompatible | incompatible | conform to | incompatible | incompatible | incompatible |
| Maker | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor | ROHM Semiconductor |
| Parts packaging code | DIP | SSOP | SOIC | DIP | SOIC | DIP |
| package instruction | DIP, DIP22,.3 | SSOP, SOP24,.3,32 | SOP, SOP22,.3 | SDIP, SDIP22,.3 | SOP, SOP20,.3 | DIP, DIP20,.3 |
| Contacts | 22 | 24 | 22 | 22 | 20 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| Has ADC | NO | NO | NO | NO | NO | NO |
| bit size | 4 | 4 | 4 | 4 | 4 | 4 |
| maximum clock frequency | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| DAC channel | NO | NO | NO | NO | NO | NO |
| DMA channel | NO | NO | NO | NO | NO | NO |
| JESD-30 code | R-PDIP-T22 | R-PDSO-G24 | R-PDSO-G22 | R-PDIP-T22 | R-PDSO-G20 | R-PDIP-T20 |
| length | 26.3 mm | 10 mm | 13.6 mm | 19.4 mm | 12.5 mm | 26.3 mm |
| Number of I/O lines | 17 | 17 | 17 | 17 | 15 | 15 |
| Number of terminals | 22 | 24 | 22 | 22 | 20 | 20 |
| Maximum operating temperature | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
| Minimum operating temperature | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| PWM channel | NO | NO | NO | NO | NO | NO |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SSOP | SOP | SDIP | SOP | DIP |
| Encapsulate equivalent code | DIP22,.3 | SOP24,.3,32 | SOP22,.3 | SDIP22,.3 | SOP20,.3 | DIP20,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE, SHRINK PITCH | SMALL OUTLINE | IN-LINE |
| power supply | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM (bytes) | 16 | 16 | 16 | 16 | 16 | 16 |
| rom(word) | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| ROM programmability | MROM | MROM | MROM | MROM | MROM | MROM |
| Maximum seat height | 4.45 mm | 1.9 mm | 1.9 mm | 4.25 mm | 1.9 mm | 4.35 mm |
| speed | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz | 1 MHz |
| Maximum slew rate | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA | 1 mA |
| Maximum supply voltage | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V |
| Minimum supply voltage | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
| Nominal supply voltage | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| surface mount | NO | YES | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 0.8 mm | 1.27 mm | 1.778 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| width | 7.62 mm | 5.4 mm | 5.4 mm | 7.62 mm | 5.4 mm | 7.62 mm |
| uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| JESD-609 code | e0 | e0 | - | e0 | e0 | e0 |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |