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DS33Z44

Description
DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PBGA256, 17 X 17 MM, 1 MM PITCH, CSBGA-256
CategoryWireless rf/communication    Telecom circuit   
File Size2MB,184 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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DATACOM, NETWORK INTERFACE SUPPORT CIRCUIT, PBGA256, 17 X 17 MM, 1 MM PITCH, CSBGA-256

DS33Z44 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeBGA
package instructionBGA,
Contacts256
Reach Compliance Codeunknown
JESD-30 codeS-PBGA-B256
JESD-609 codee0
length17 mm
Humidity sensitivity levelNOT APPLICABLE
Number of functions1
Number of terminals256
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Peak Reflow Temperature (Celsius)245
Certification statusCOMMERCIAL
Maximum seat height1.77 mm
Nominal supply voltage1.8 V
surface mountYES
Telecom integrated circuit typesSUPPORT CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width17 mm
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