05107
P0402FC3.3C*
thru
P0402FC36C*
FLIP CHIP ARRAY
APPLICATIONS
✔
Cellular Phones
✔
MCM Boards
✔
Wireless Communication Circuits
✔
IR LEDs
✔
SMART & PCMCIA Cards
IEC COMPATIBILITY
(EN61000-4)
✔
61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔
61000-4-4 (EFT): 40A - 5/50ns
0402
FEATURES
✔
ESD Protection > 25 kilovolts
✔
Available in Voltages Ranging From 3.3V to 36V
✔
250 Watts Peak Pulse Power per Line (tp = 8/20μs)
✔
Bidirectional Configuration & Monolithic Structure
✔
Protects 1 Line
✔
RoHS Compliant
MECHANICAL CHARACTERISTICS
✔
Standard EIA Chip Size: 0402
✔
Weight 0.73 milligrams (Approximate)
✔
Available in Lead-Free Plating
✔
Solder Reflow Temperature:
Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C
✔
Consult Factory for Leaded Device Availability
✔
Flammability Rating UL 94V-0
✔
8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔
Device Marking On Reel
✔
Top Contacts: Solder Bump 0.004” in Height (Nominal)
PIN CONFIGURATION
05107.R11 10/09
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*U.S. Patent No. Des. “D456,367S”
P0402FC3.3C*
thru
P0402FC36C*
DEVICE CHARACTERISTICS
MAXIMUM RATINGS
@ 25°C Unless Otherwise Specified
PARAMETER
Peak Pulse Power (tp = 8/20μs) - See Figure 1
Operating Temperature
Storage Temperature
SYMBOL
P
PP
T
A
T
STG
VALUE
250
-55 to 150
-55 to 150
UNITS
Watts
°C
°C
ELECTRICAL CHARACTERISTICS PER LINE
PART
NUMBER
(See Note 1)
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
@ 1mA
V
(BR)
VOLTS
4.0
6.0
8.5
13.3
16.7
26.7
40.0
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@ I
P
= 1A
V
C
VOLTS
7.0
11.0
13.2
19.8
25.4
37.2
70.0
@ 25°C Unless Otherwise Specified
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
@8/20μs
V
C
@ I
PP
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
@V
WM
I
D
μA
75*
10**
10***
1
1
1
1
TYPICAL
CAPACITANCE
V
WM
VOLTS
P0402FC3.3C
P0402FC05C
P0402FC08C
P0402FC12C
P0402FC15C
P0402FC24C
P0402FC36C
3.3
5.0
8.0
12.0
15.0
24.0
36.0
@0V, 1 MHz
C
pF
150
100
75
50
40
30
25
Note 1:
All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2:
*Maximum leakage current < 5μA @ 2.8V. **Maximum leakage current <500nA @ 3.3V. ***Maximum leakage current <200nA @ 5V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
10,000
I
PP
- Peak Pulse Current - % of I
PP
P
PP
- Peak Pulse Current - Watts
120
100
80
60
40
20
0
t
f
FIGURE 2
PULSE WAVE FORM
Peak Value I
PP
TEST
WAVEFORM
PARAMETERS
t
f
= 8μs
t
d
= 20μs
1,000
250W, 8/20μs Waveform
e
-t
100
t
d
= t I /2
PP
10
0.01
1
10
100
t
d
- Pulse Duration -
μs
1,000
10,000
0
5
10
15
t - Time -
μs
20
25
30
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*U.S. Patent No. Des. “D456,367S”
P0402FC3.3C*
thru
P0402FC36C*
GRAPHS
100
80
% Of Rated Power
FIGURE 3
POWER DERATING CURVE
Peak Pulse Power
8/20μs
60
40
20
Average Power
0
0
25
50
75
100
125
T
A
- Ambient Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR P0402FC05C
35
5 Volts per Division
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE
5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR P0402FC05C
14
12
10
8
6
4
2
0
0
5
10
I
PP
- Peak Pulse Current - Amps
15
20
05107.R11 10/09
V
C
- Clamping Voltage - Volts
3
www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
P0402FC3.3C*
thru
P0402FC36C*
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50μm
±20μm
60 Seconds
270°C
VALUE
REQUIREMENTS
Temperature:
T
P
for Lead-Free (SnAgCu): 260-270°C
T
P
for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
Non-Solder Mask Defined Pad
0.275mm DIA.
Solder Mask Opening
0.325mm DIA.
Solder
Stencil Opening
0.330mm DIA.
Maximum Solder Reflow
(35-53°C Above Maximum Solder Melt Temp)
TP
Ramp-Up
Solder Melt (Maximum Temp)
Temperature - °C
Flux Activation Temp
Ramp-Down
Preheat
(Stay Below Flux Activation Temp)
30-60 seconds
Ramp-Up
15 seconds
(Minimize)
Solder-Time
15-20 seconds
Ramp-Down
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*U.S. Patent No. Des. “D456,367S”
P0402FC3.3C*
thru
P0402FC36C*
0402 PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
DIM
A
B
C
D
E
F
G
H
I
PACKAGE DIMENSIONS
MILLIMETERS
0.46 NOM
0.86 NOM
0.99 ± 0.0254
0.10 NOM
0.35 NOM
0.483 ± 0.0254
0.20 NOM
0.127 MAX
0.076 MIN
0.406 NOM
INCHES
0.018 NOM
0.034 NOM
0.039 ± 0.001
0.004 NOM
0.014 NOM
0.019 ± 0.001
0.008 NOM
0.005 MAX
0.003 MIN
0.016 NOM
TOP
A B
C
E
F
D
H
G
SIDE
NOTES:
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”).
3. Maximum chip size: 1.02 (0.040”) by 0.51(0.020”).
END
I
MOUNTING PAD
B
C
A
SOLDER PAD
PAD DIMENSIONS
DIM
D
MILLIMETERS
0.23
0.48
0.69
0.46
0.99
0.20
0.20
0.66
0.13
INCHES
0.009
0.019
0.027
0.018
0.039
0.008
0.008
0.026
0.005
SOLDER
BUMP
F
E
A
B
C
D
E
F
G
H
I
DIE
H
NOTE:
1. Top view of tape. Metal contacts are face down in tape package.
TAPE & REEL ORIENTATION
SOLDER PRINT
DIAMETER 0.010 - 0.012
G
TAPE & REEL ORDERING NOMENCLATURE
1. Surface mount product is taped and reeled in accordance with EIA 481.
2.
8mm Paper Tape:
7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., P0402FC05C-T710-2).
3. Suffix - LF = Lead-Free, i.e., P0402FC05C-LF-T710-2.
Outline & Dimensions: Rev 3 - 11/02, 06001
NOTE:
1.
Preferred:
Using 0.1mm (0.004”) stencil.
Single Die - 0402
Tape & Reel Specifications (Dimensions in millimeters)
Reel Dia.
178mm (7”)/330mm(13”)
Tape Width
8mm
E
F
W
P0
P2
P
0.80± 0.10 1.20± 0.10 0.70 ± 0.10 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 2.00 ±0.10
A0
B0
K0
P0
t
D
P2
10 Pitches Cumulative
Tolerance on Tape. ± 0.2
D
tmax
0.25
E
Top cover tape
A0
K0
B0
F
W
P
User Direction of Feed
COPYRIGHT © ProTek Devices 2007
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC).
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s
and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products.
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: sales@protekdevices.com
Web Site: www.protekdevices.com
05107.R11 10/09
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www.protekdevices.com
*U.S. Patent No. Des. “D456,367S”
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