M1MA151AT1,
M1MA152AT1
Preferred Device
Single Silicon Switching
Diodes
These Silicon Epitaxial Planar Diodes are designed for use in ultra
high speed switching applications. These devices are housed in the
SC–59 package which is designed for low power surface mount
applications.
•
Fast t
rr
, < 3.0 ns
•
Low C
D
, < 2.0 pF
•
Available in 8 mm Tape and Reel
Use M1MA151/2AT1 to order the 7 inch/3000 unit reel.
Use M1MA151/2AT3 to order the 13 inch/10,000 unit reel.
MAXIMUM RATINGS
(T
A
= 25°C)
Rating
Reverse Voltage
M1MA151AT1
M1MA152AT1
Peak Reverse Voltage
M1MA151AT1
M1MA152AT1
Forward Current
Peak Forward Current
Peak Forward Surge Current
I
F
I
FM
I
FSM
(Note 1)
V
RM
Symbol
V
R
Value
40
80
40
80
100
225
500
mAdc
mAdc
mAdc
2
1
3
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SC–59 PACKAGE SINGLE SILICON
SWITCHING DIODES 40/80 V–100 mA
SURFACE MOUNT
ANODE
3
Unit
Vdc
1
2
CATHODE NO CONNECTION
Vdc
THERMAL CHARACTERISTICS
Rating
Power Dissipation
Junction Temperature
Storage Temperature
1. t = 1 SEC
Symbol
P
D
T
J
T
stg
Max
200
150
–55 to +150
Unit
mW
°C
°C
SC–59
SUFFIX
CASE 318D
MARKING DIAGRAM
Mx M
x = A for 151
B for 152
M = Date Code
Preferred
devices are recommended choices for future use
and best overall value.
Preferred
devices are ON Semiconductor recommended choices for future use and best overall value.
©
Semiconductor Components Industries, LLC, 2002
1
May, 2002 – Rev. 6
Publication Order Number:
M1MA151AT1/D
M1MA151AT1, M1MA152AT1
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C)
Characteristic
Reverse Voltage Leakage Current
M1MA151AT1
M1MA152AT1
Forward Voltage
Reverse Breakdown Voltage
M1MA151AT1
M1MA152AT1
Diode Capacitance
Reverse Recovery Time (Figure 1)
2. t
rr
Test Circuit
C
D
t
rr
(Note 2)
V
R
= 0, f = 1.0 MHz
I
F
= 10 mA, V
R
= 6.0 V,
R
L
= 100
W,
I
rr
= 0.1 I
R
V
F
V
R
Symbol
I
R
Condition
V
R
= 35 V
V
R
= 75 V
I
F
= 100 mA
I
R
= 100
mA
Min
—
—
—
40
80
—
—
Max
0.1
0.1
1.2
—
—
2.0
3.0
pF
ns
Vdc
Vdc
Unit
mAdc
RECOVERY TIME EQUIVALENT TEST CIRCUIT
INPUT PULSE
t
r
t
p
t
OUTPUT PULSE
I
F
t
rr
t
A
R
L
10%
I
rr
= 0.1 I
R
90%
V
R
t
p
= 2
ms
t
r
= 0.35 ns
I
F
= 10 mA
V
R
= 6 V
R
L
= 100
Ω
Figure 1. Reverse Recovery Time Equivalent Test Circuit
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2
M1MA151AT1, M1MA152AT1
INFORMATION FOR USING THE SC–59 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
0.037
0.95
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
0.037
0.95
0.094
2.4
0.039
1.0
0.031
0.8
inches
mm
SC–59 POWER DISSIPATION
The power dissipation of the SC–59 is a function of the
pad size. This can vary from the minimum pad size for sol-
dering to the pad size given for maximum power dissipa-
tion. Power dissipation for a surface mount device is deter-
mined by T
J(max)
, the maximum rated junction temperature
of the die, Rθ
JA
, the thermal resistance from the device
junction to ambient; and the operating temperature, T
A
. Us-
ing the values provided on the data sheet, P
D
can be calcu-
lated as follows.
P
D
=
T
J(max)
– T
A
R
θJA
the equation for an ambient temperature T
A
of 25°C, one
can calculate the power dissipation of the device which in
this case is 338 milliwatts.
P
D
=
150°C – 25°C
370°C/W
= 338 milliwatts
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
The 370°C/W assumes the use of the recommended foot-
print on a glass epoxy printed circuit board to achieve a
power dissipation of 338 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad™. Using a board material such
as Thermal Clad, the power dissipation can be doubled us-
ing the same footprint.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are
subjected.
•
Always preheat the device.
•
The delta temperature between the preheat and
soldering should be 100°C or less.*
•
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference should be a maximum of 10°C.
•
The soldering temperature and time should not exceed
260°C for more than 10 seconds.
•
When shifting from preheating to soldering, the
maximum temperature gradient should be 5°C or less.
•
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
•
Mechanical stress or shock should not be applied dur-
ing cooling
* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.
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3
M1MA151AT1, M1MA152AT1
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
TYPICAL SOLDER HEATING PROFILE
For any given circuit board, there will be a group of
control settings that will give the desired heat pattern. The
operator must set temperatures for several heating zones,
and a figure for belt speed. Taken together, these control
settings make up a heating “profile” for that particular
circuit board. On machines controlled by a computer, the
computer remembers these profiles from one operating
session to the next. Figure 7 shows a typical heating profile
for use when soldering a surface mount device to a printed
circuit board. This profile will vary among soldering
systems but it is a good starting point. Factors that can
affect the profile include the type of soldering system in
use, density and types of components on the board, type of
solder used, and the type of board or substrate material
being used. This profile shows temperature versus time.
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177–189°C. When this type of furnace is used for solder
reflow work, the circuit boards and solder joints tend to
heat first. The components on the board are then heated by
conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then
distributes this energy to the components. Because of this
effect, the main body of a component may be up to 30
degrees cooler than the adjacent solder joints.
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
STEP 2
STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
SPIKE"
SOAK"
170°C
160°C
STEP 6 STEP 7
VENT COOLING
205° TO 219°C
PEAK AT
SOLDER JOINT
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
150°C
150°C
100°C
100°C
140°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
50°C
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
T
MAX
Figure 2. Typical Solder Heating Profile
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4
M1MA151AT1, M1MA152AT1
PACKAGE DIMENSIONS
SC–59
CASE 318D–04
ISSUE F
A
L
3
2
1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
S
B
D
G
C
H
K
J
DIM
A
B
C
D
G
H
J
K
L
S
MILLIMETERS
MIN
MAX
2.70
3.10
1.30
1.70
1.00
1.30
0.35
0.50
1.70
2.10
0.013
0.100
0.09
0.18
0.20
0.60
1.25
1.65
2.50
3.00
INCHES
MIN
MAX
0.1063 0.1220
0.0512 0.0669
0.0394 0.0511
0.0138 0.0196
0.0670 0.0826
0.0005 0.0040
0.0034 0.0070
0.0079 0.0236
0.0493 0.0649
0.0985 0.1181
STYLE 4:
PIN 1. N.C.
2. CATHODE
3. ANODE
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