Standard SRAM, 4KX1, 25ns, CDIP18
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | AMD |
| package instruction | DIP, DIP18,.3 |
| Reach Compliance Code | compliant |
| Maximum access time | 25 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-XDIP-T18 |
| JESD-609 code | e0 |
| memory density | 4096 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Negative supply voltage rating | -5.2 V |
| Number of terminals | 18 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 4KX1 |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP18,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Parallel/Serial | PARALLEL |
| power supply | -5.2 V |
| Maximum slew rate | 0.2 mA |
| surface mount | NO |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| AM10470ADCTB | AM10470ADCT | AM10470SADCT | AM10470SADCTB | |
|---|---|---|---|---|
| Description | Standard SRAM, 4KX1, 25ns, CDIP18 | Standard SRAM, 4KX1, 25ns, CDIP18 | Standard SRAM, 4KX1, 15ns, CDIP18 | Standard SRAM, 4KX1, 15ns, CDIP18 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | AMD | AMD | AMD | AMD |
| package instruction | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 | DIP, DIP18,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant |
| Maximum access time | 25 ns | 25 ns | 15 ns | 15 ns |
| I/O type | SEPARATE | SEPARATE | SEPARATE | SEPARATE |
| JESD-30 code | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 | R-XDIP-T18 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 | 1 | 1 |
| Negative supply voltage rating | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| Number of terminals | 18 | 18 | 18 | 18 |
| word count | 4096 words | 4096 words | 4096 words | 4096 words |
| character code | 4000 | 4000 | 4000 | 4000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 4KX1 | 4KX1 | 4KX1 | 4KX1 |
| Package body material | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| encapsulated code | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP18,.3 | DIP18,.3 | DIP18,.3 | DIP18,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| power supply | -5.2 V | -5.2 V | -5.2 V | -5.2 V |
| Maximum slew rate | 0.2 mA | 0.2 mA | 0.23 mA | 0.23 mA |
| surface mount | NO | NO | NO | NO |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
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