MT58LC128K16G1LG-7.5 datasheet, PDF

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MT58LC128K16G1LG-7.5: DescriptionStandard SRAM, 128KX16, 5ns, CMOS, PQFP100, TQFP-100; Categorystorage storage; File Size434KB，15 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/

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MT58LC128K16G1LG-7.5 Overview

Standard SRAM, 128KX16, 5ns, CMOS, PQFP100, TQFP-100

MT58LC128K16G1LG-7.5 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Micron Technology
Parts packaging code	QFP
package instruction	TQFP-100
Contacts	100
Reach Compliance Code	unknown
ECCN code	3A991.B.2.A
Maximum access time	5 ns
I/O type	COMMON
JESD-30 code	R-PQFP-G100
JESD-609 code	e0
length	20 mm
memory density	2097152 bit
Memory IC Type	STANDARD SRAM
memory width	16
Number of functions	1
Number of terminals	100
word count	131072 words
character code	128000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LQFP
Encapsulate equivalent code	QFP100,.63X.87
Package shape	RECTANGULAR
Package form	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.5,3.3 V
Certification status	Not Qualified
Maximum seat height	1.6 mm
Maximum standby current	0.005 A
Minimum standby current	3.13 V
Maximum slew rate	0.27 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.65 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm

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MT58LC128K16G1LG-7.5 Related Products

	MT58LC128K16G1LG-7.5	MT58LC128K18G1LG-7	MT58LC128K16G1LG-8.5	MT58LC128K16G1LG-11	MT58LC128K16G1LG-7	MT58LC128K16G1LG-10	MT58LC128K18G1LG-11
Description	Standard SRAM, 128KX16, 5ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX18, 7ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX16, 5ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX16, 6ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX16, 4.5ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX16, 5.5ns, CMOS, PQFP100, TQFP-100	Standard SRAM, 128KX18, 6ns, CMOS, PQFP100, TQFP-100
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	QFP	QFP	QFP	QFP	QFP	QFP	QFP
package instruction	TQFP-100	TQFP-100	TQFP-100	TQFP-100	TQFP-100	TQFP-100	TQFP-100
Contacts	100	100	100	100	100	100	100
Reach Compliance Code	unknown	not_compliant	not_compliant	not_compliant	unknown	unknown	not_compliant
ECCN code	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
Maximum access time	5 ns	7 ns	5 ns	6 ns	4.5 ns	5.5 ns	6 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100	R-PQFP-G100
JESD-609 code	e0	e0	e0	e0	e0	e0	e0
length	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm	20 mm
memory density	2097152 bit	2359296 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2359296 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
memory width	16	18	16	16	16	16	18
Number of functions	1	1	1	1	1	1	1
Number of terminals	100	100	100	100	100	100	100
word count	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words	131072 words
character code	128000	128000	128000	128000	128000	128000	128000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
organize	128KX16	128KX18	128KX16	128KX16	128KX16	128KX16	128KX18
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP	LQFP
Encapsulate equivalent code	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87	QFP100,.63X.87
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE	FLATPACK, LOW PROFILE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V	2.5,3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm
Maximum standby current	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A	0.005 A
Minimum standby current	3.13 V	3.14 V	3.13 V	3.13 V	3.14 V	3.13 V	3.14 V
Maximum slew rate	0.27 mA	0.15 mA	0.26 mA	0.24 mA	0.15 mA	0.25 mA	0.24 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
Terminal pitch	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm	0.65 mm
Terminal location	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
width	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm	14 mm
Maker	Micron Technology	-	-	-	Micron Technology	Micron Technology	Micron Technology

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