ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 24 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum analog input voltage | 5 V |
| Minimum analog input voltage | |
| Maximum conversion time | 13000000 µs |
| Converter type | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code | R-PDIP-T24 |
| JESD-609 code | e0 |
| length | 30.545 mm |
| Maximum linear error (EL) | 0.012% |
| Nominal negative supply voltage | -15 V |
| Number of analog input channels | 1 |
| Number of digits | 12 |
| Number of functions | 1 |
| Number of terminals | 24 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output bit code | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY |
| Output format | PARALLEL, 8 BITS |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 4.572 mm |
| Maximum slew rate | 12 mA |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| MX7572LN12-T | MX7572LN05-T | MAX162BCNG-T | MX7572JN05-T | MX7572JN12-T | MX7572KN05-T | MX7572KN12-T | MAX162CCNG-T | MAX162ACNG-T | |
|---|---|---|---|---|---|---|---|---|---|
| Description | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 | ADC, Successive Approximation, 12-Bit, 1 Func, 1 Channel, Parallel, 8 Bits Access, CMOS, PDIP24, PLASTIC, DIP-24 |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim |
| Parts packaging code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| package instruction | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, | DIP, |
| Contacts | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum analog input voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Maximum conversion time | 13000000 µs | 5200000 µs | 3250000 µs | 5200000 µs | 13000000 µs | 5200000 µs | 13000000 µs | 3250000 µs | 3250000 µs |
| Converter type | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 code | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 30.545 mm | 30.545 mm | 30.545 mm | 30.545 mm | 30.545 mm | 30.545 mm | 30.545 mm | 30.545 mm | 30.545 mm |
| Maximum linear error (EL) | 0.012% | 0.012% | 0.024% | 0.024% | 0.024% | 0.024% | 0.024% | 0.024% | 0.012% |
| Nominal negative supply voltage | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| Number of analog input channels | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of digits | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Output bit code | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY | OFFSET BINARY, COMPLEMENTARY OFFSET BINARY |
| Output format | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS | PARALLEL, 8 BITS |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm | 4.572 mm |
| Maximum slew rate | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA | 12 mA |
| Nominal supply voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
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