Analog Circuit, CMOS, PDSO8,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | SIPEX |
| package instruction | SOP, SOP8,.25 |
| Reach Compliance Code | unknown |
| Maximum input voltage | 12 V |
| Minimum input voltage | 1.5 V |
| JESD-30 code | R-PDSO-G8 |
| JESD-609 code | e0 |
| Humidity sensitivity level | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Maximum output current | 0.02 A |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP8,.25 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Certification status | Not Qualified |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| AS1044SIS | AS1044SCP | AS1044SIP | AS1044SCS | |
|---|---|---|---|---|
| Description | Analog Circuit, CMOS, PDSO8, | Analog Circuit, CMOS, PDIP8, | Analog Circuit, CMOS, CDIP8, | Analog Circuit, CMOS, PDSO8, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | SIPEX | SIPEX | SIPEX | SIPEX |
| package instruction | SOP, SOP8,.25 | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Maximum input voltage | 12 V | 12 V | 12 V | 12 V |
| Minimum input voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| JESD-30 code | R-PDSO-G8 | R-PDIP-T8 | R-XDIP-T8 | R-PDSO-G8 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of terminals | 8 | 8 | 8 | 8 |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 70 °C |
| Maximum output current | 0.02 A | 0.02 A | 0.02 A | 0.02 A |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | DIP | SOP |
| Encapsulate equivalent code | SOP8,.25 | DIP8,.3 | DIP8,.3 | SOP8,.25 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | NO | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |