4KX1 STANDARD SRAM, 45ns, DFP18, FORMED, FP-18
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | STMicroelectronics |
| Parts packaging code | DFP |
| package instruction | FORMED, FP-18 |
| Contacts | 18 |
| Reach Compliance Code | not_compliant |
| ECCN code | 3A001.A.2.C |
| Maximum access time | 45 ns |
| I/O type | SEPARATE |
| JESD-30 code | R-XDFP-F18 |
| JESD-609 code | e0 |
| length | 10.973 mm |
| memory density | 4096 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 1 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 18 |
| word count | 4096 words |
| character code | 4000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 4KX1 |
| Output characteristics | 3-STATE |
| Exportable | NO |
| Package body material | UNSPECIFIED |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL18,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| Maximum seat height | 2.235 mm |
| Maximum standby current | 0.005 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 0.08 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.194 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| IMS1203A-45M | 5962-8751301XC | IMS1203S-25M | 5962-8751301VC | 5962-8751302XC | 5962-8751303VC | 5962-8751303XC | 5962-8751302VC | IMS1203A-25M | IMS1203S-45M | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | 4KX1 STANDARD SRAM, 45ns, DFP18, FORMED, FP-18 | 4KX1 STANDARD SRAM, 25ns, CDFP18, FP-18 | 4KX1 STANDARD SRAM, 25ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 | 4KX1 STANDARD SRAM, 25ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | 4KX1 STANDARD SRAM, 35ns, CDFP18, FP-18 | 4KX1 STANDARD SRAM, 45ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | 4KX1 STANDARD SRAM, 45ns, CDFP18, FP-18 | 4KX1 STANDARD SRAM, 35ns, CDIP18, 0.300 INCH, CERAMIC, DIP-18 | 4KX1 STANDARD SRAM, 25ns, DFP18, FORMED, FP-18 | 4KX1 STANDARD SRAM, 45ns, CDIP18, 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 |
| Parts packaging code | DFP | DFP | DIP | DIP | DFP | DIP | DFP | DIP | DFP | DIP |
| package instruction | FORMED, FP-18 | DFP, | DIP, DIP18,.3 | DIP, | DFP, | DIP, | DFP, | DIP, | FORMED, FP-18 | 0.300 INCH, SIDE BRAZED, CERAMIC, DIP-18 |
| Contacts | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| Reach Compliance Code | not_compliant | unknown | not_compliant | unknown | unknown | unknown | unknown | unknown | _compli | not_compliant |
| ECCN code | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| Maximum access time | 45 ns | 25 ns | 25 ns | 25 ns | 35 ns | 45 ns | 45 ns | 35 ns | 25 ns | 45 ns |
| JESD-30 code | R-XDFP-F18 | R-CDFP-F18 | R-CDIP-T18 | R-CDIP-T18 | R-CDFP-F18 | R-CDIP-T18 | R-CDFP-F18 | R-CDIP-T18 | R-XDFP-F18 | R-CDIP-T18 |
| JESD-609 code | e0 | e4 | e0 | e4 | e4 | e4 | e4 | e4 | e0 | e0 |
| length | 10.973 mm | 10.973 mm | 22.86 mm | 22.86 mm | 10.973 mm | 22.86 mm | 10.973 mm | 22.86 mm | 10.973 mm | 22.86 mm |
| memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bi | 4096 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| word count | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| character code | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| organize | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 | 4KX1 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| Package body material | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP | DFP | DIP | DIP | DFP | DIP | DFP | DIP | DFP | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE | FLATPACK | IN-LINE |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | NO | NO | YES | NO | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | GOLD | Tin/Lead (Sn/Pb) | GOLD | GOLD | GOLD | GOLD | GOLD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 1.194 mm | 1.194 mm | 2.54 mm | 2.54 mm | 1.194 mm | 2.54 mm | 1.194 mm | 2.54 mm | 1.194 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | STMicroelectronics | - | STMicroelectronics | - | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - | - |