REVISIONS
LTR
A
DESCRIPTION
Added radiation hardness assurance requirements. Paragraph 1.4:
Corrected Output voltage range from "+1.0 V to +3.3 V" to "+.985 V to
+4.5 V". Table I: Added test conditions for the Reference voltage,
Line regulation, Load regulation, Dropout voltage, and Ripple rejection
tests. Table I: Corrected the min and max limits for the Reference
voltage test. Table I: Corrected the min limit for the Ripple rejection
ratio test. Table I: Corrected the max limit for the Dropout voltage.
-sld
DATE (YR-MO-DA)
13-06-17
APPROVED
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
A
15
A
16
REV
SHEET
PREPARED BY
Steve L. Duncan
CHECKED BY
Greg Cecil
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
A
9
A
10
A
11
A
12
A
13
A
14
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil/
STANDARD MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
APPROVED BY
Charles F. Saffle
DRAWING APPROVAL DATE
12-12-11
REVISION LEVEL
A
MICROCIRCUIT, HYBRID, POSITIVE
VOLTAGE REGULATOR, 7.5 AMPS, LOW
DROPOUT, ADJUSTABLE
SIZE
A
SHEET
CAGE CODE
67268
1
OF
16
5962-E451-13
5962-09237
DSCC FORM 2233
APR 97
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
Federal
stock class
designator
\
R
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
VRG8691, VRG8692
Circuit function
Voltage regulator, positive, low dropout, adjustable
09237
01
Device
type
(see 1.2.2)
/
K
Device
class
designator
(see 1.2.3)
X
Case
outline
(see 1.2.4)
X
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level.
All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K,
and E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
H
G
E
D
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
A
5962-09237
SHEET
2
DSCC FORM 2234
APR 97
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Descriptive designator
See figure 1
See figure 1
Terminals
12
12
Package style
Thru-Hole
Surface Mount
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
V
BIAS
, V
IN
...........................................................................................................
Power.................................................................................................................
Junction temperature (T
J
) ..................................................................................
Thermal resistance, junction-to-case (θ
JC
) .........................................................
Lead temperature (soldering, 10 seconds) ........................................................
Storage temperature range ................................................................................
1.4 Recommended operating conditions.
Output voltage range .........................................................................................
Output current range .........................................................................................
Voltage Bias (V
BIAS
) range.................................................................................
Voltage Input (V
IN
) range ...................................................................................
Case operating temperature range (T
C
) ............................................................
1.5 Radiation features. 4/ 5/
Maximum Total Ionizing Dose (TID) ..(dose rate = 50 - 300 rad(Si)/s) ..............
Single event phenomenon (SEP) effective linear energy transfer (LET):
No SEL, SEU, or SET.....................................................................................
.2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
100 krad(Si) 6 7/
< 86 MeV-cm /mg 8/
2
+7.0 V
25 W 2/
+150°C
1°C/W
300°C
-65°C to +150°C
+.985 V to +4.5 V dc
0 to 7.5 A
+3.3 V to +5.5 V dc 3/
+1.8 V to +5.5 V dc
-55°C to +125°C
1/
2/
3/
4/
5/
6/
7/
8/
Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Based on pass transistor limitations of (V
I
N
- V
O
) x I
O
and
θ
JC
≤ 1°C/W with 25°C max T
J
rise at T
C
= +125°C.
V
BIAS
must maintain a level equal or above V
IN
but not fall below +3.3 V.
See section 4.3.5 for the manufacturer's radiation hardness assurance analysis and testing.
Bipolar device types may degrade from displacement damage from radiation which could affect RHA levels. This device
has not been characterized for displacement damage.
This device was tested initially using Conditon A, Method 1019 of MIL-STD-883 to 500 krad(Si) to assure Radiation
Hardness Assurance designator level "R”. The device will be re-tested after design or process changes that may affect the
RHA response of the device.
This device may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end-point limits for the noted parameters are guaranteed only for the conditions as specified in MIL-STD-883,
method 1019, condition A for these parameters.
2
Single event testing performed at 86 Mev-cm /mg with no single event latch up, no single event upset and no single event
transients observed. See table IB herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
A
5962-09237
SHEET
3
DSCC FORM 2234
APR 97
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://quicksearch.dla.mil
or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein.
AMERICAN SOCIETY FOR TESTING AND MATERIALS (ASTM)
ASTM F1192 - Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by
Heavy Ion Irradiation of Semiconductor Devices.
(Copies of these documents are available online at
http://www.astm.org
or from the American Society for Testing and
Materials, P O Box C700, 100 Barr Harbor Drive, West Conshohocken, PA 19428-2959)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Radiation exposure circuits. The radiation exposure circuits shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table IA.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
A
5962-09237
SHEET
4
DSCC FORM 2234
APR 97
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the
manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
SIZE
A
REVISION LEVEL
A
5962-09237
SHEET
5
DSCC FORM 2234
APR 97
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