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LTC4303IMS8#TR

Description
LTC4303 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: MSOP; Pins: 8; Temperature Range: -40°C to 85°C
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size525KB,12 Pages
ManufacturerLinear ( ADI )
Websitehttp://www.analog.com/cn/index.html
Download Datasheet Parametric Compare View All

LTC4303IMS8#TR Overview

LTC4303 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: MSOP; Pins: 8; Temperature Range: -40°C to 85°C

LTC4303IMS8#TR Parametric

Parameter NameAttribute value
Brand NameLinear Technology
Is it Rohs certified?incompatible
MakerLinear ( ADI )
Parts packaging codeMSOP
package instructionTSSOP, TSSOP8,.19
Contacts8
Manufacturer packaging codeMS8
Reach Compliance Codenot_compliant
ECCN codeEAR99
Interface integrated circuit typeINTERFACE CIRCUIT
JESD-30 codeS-PDSO-G8
JESD-609 codee0
length3 mm
Humidity sensitivity level1
Number of functions1
Number of terminals8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.19
Package shapeSQUARE
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius)235
power supply3/5 V
Certification statusNot Qualified
Maximum seat height1.1 mm
Maximum slew rate8 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.7 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature20
width3 mm
FEATURES
LTC4303
Hot Swappable 2-Wire
Bus Buffer with Stuck
Bus Recovery
DESCRIPTIO
The LTC
®
4303 hot swappable 2-wire Bus Buffer allows I/O
card insertion into a live backplane without corruption of
the data and clock busses. When a connection is made,
the LTC4303 provides bidirectional buffering, keeping the
backplane and card capacitances isolated. If SDAOUT or
SCLOUT is low for ≥ 30ms (typ), the LTC4303 automatically
breaks the data and clock bus connection. At this time the
LTC4303 automatically generates up to 16 clock pulses on
SCLOUT in an attempt to free the bus. A connection will
be enabled automatically when the bus becomes free.
Rise-time accelerator circuitry allows the use of larger pull-
up resistance while still meeting rise-time requirements.
During insertion, the SDA and SCL lines are precharged
to 1V to minimize bus disturbances. When driven high,
ENABLE allows the LTC4303 to connect after a stop bit or
bus idle occurs. Driving ENABLE low breaks the connection
between SDAIN and SDAOUT, SCLIN and SCLOUT. READY
is an open drain output that indicates when the backplane
and card sides are connected together.
, LT, LTC and LTM are registered trademarks of Linear Technology Corporation.
All other trademarks are the property of their respective owners.
Protected by U.S. Patents including 6356140, 6650174, 7032051.
Automatic Disconnect of SDA/SCL Lines when Bus
is Stuck Low for ≥ 30ms
Recovers Stuck Busses with Automatic Clocking*
Bidirectional Buffer* for SDA and SCL Lines
Increases Fanout
Prevents SDA and SCL Corruption During Live
Board Insertion and Removal from Backplane
Pin Compatible with LTC4300A-1
±15kV Human Body Model ESD Protection
Isolates Input SDA and SCL Lines from Output
Compatible with I
2
C
TM
, I
2
C Fast-Mode and SMBus
Standards (Up to 400kHz Operation)
READY Open Drain Output
1V Precharge on All SDA and SCL Lines
High Impedance SDA, SCL Pins for V
CC
= 0V
ENABLE Gates Connection from Input to Output
MSOP 8-Pin and DFN (3mm
×
3mm) Packages
Hot Board Insertion
Servers
Capacitance Buffer/Bus Extender
RAID Systems
APPLICATIO S
TYPICAL APPLICATIO
5V 3.3V
10k
BACK_SCL
10k
0.01
m
F
10k
V
CC
LTC4303
SCLIN
SCLOUT
CARD_SCL
SDAOUT
5V/DIV
10k
SDAIN
BACK_SDA
SDAOUT
CARD_SDA
SDAIN
5V/DIV
AUTOMATIC CLOCKING
3.3V
100k
ENABLE
GND
READY
4303
TA01
SCLOUT
5V/DIV
4303 TA01b
BACKPLANE
CONNECTOR
STAGGERED
CONNECTOR
CARD
U
U
U
Stuck Bus Resolved
with Automatic Clocking
STUCK LOW > 30ms
RECOVERS
DISCONNECT AT TIMEOUT
200
m
s/DIV
4303fb
1

LTC4303IMS8#TR Related Products

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Description LTC4303 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: MSOP; Pins: 8; Temperature Range: -40°C to 85°C LTC4303 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: MSOP; Pins: 8; Temperature Range: 0°C to 70°C LTC4303 - Hot Swappable 2-Wire Bus Buffer with Stuck Bus Recovery; Package: DFN; Pins: 8; Temperature Range: -40°C to 85°C
Brand Name Linear Technology Linear Technology Linear Technology
Is it Rohs certified? incompatible incompatible incompatible
Maker Linear ( ADI ) Linear ( ADI ) Linear ( ADI )
Parts packaging code MSOP MSOP DFN
package instruction TSSOP, TSSOP8,.19 TSSOP, TSSOP8,.19 HVSON, SOLCC8,.11,20
Contacts 8 8 8
Manufacturer packaging code MS8 MS8 DD
Reach Compliance Code not_compliant not_compliant not_compliant
ECCN code EAR99 EAR99 EAR99
Interface integrated circuit type INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 code S-PDSO-G8 S-PDSO-G8 S-PDSO-N8
JESD-609 code e0 e0 e0
length 3 mm 3 mm 3 mm
Humidity sensitivity level 1 1 1
Number of functions 1 1 1
Number of terminals 8 8 8
Maximum operating temperature 85 °C 70 °C 85 °C
Minimum operating temperature -40 °C - -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP HVSON
Encapsulate equivalent code TSSOP8,.19 TSSOP8,.19 SOLCC8,.11,20
Package shape SQUARE SQUARE SQUARE
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius) 235 235 235
power supply 3/5 V 3/5 V 3/5 V
Certification status Not Qualified Not Qualified Not Qualified
Maximum seat height 1.1 mm 1.1 mm 0.8 mm
Maximum slew rate 8 mA 8 mA 8 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.7 V 2.7 V 2.7 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level INDUSTRIAL COMMERCIAL INDUSTRIAL
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form GULL WING GULL WING NO LEAD
Terminal pitch 0.65 mm 0.65 mm 0.5 mm
Terminal location DUAL DUAL DUAL
Maximum time at peak reflow temperature 20 20 20
width 3 mm 3 mm 3 mm
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