IC37 Series
Specifications
Dual Inline Package
(DIP)
Part Number
(Details)
Insulation Resistance:
1,000M
W
min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
20m
W
max. at 10mA /20mV max.
Current Rating:
1A max.
Operating Temperature Range: –40°C to +170°C (PPS)
Mating Cycles:
25,000 to 50,000 insertions
IC37N
Series No.
R B
-
14 03
-
G 4
Housing Material
R =PPS
Contact Plating:
B =
Mating Ter. 0.3µm Au
Solder Ter. 0.1µm Au
Materials and Finish
Housing: Polyphenylenesulfide (PPS), glass filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
No. of Contact Pins
Features
í
Dual wipe contacts ensure high reliability
í
Low costs due to selective gold plating
í
Applicable for IC packages and side braze packages
í
Ideal for automated burn-in
Row Space (03 = 0.3 inches)
Gold Plating
Straight, Through Hole Type
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
2.4
A
B
±0.05
0.36
-0.1
+0.2
B
±0.1
1.8
3.2
H
J
±0.2
J
±0.1
2.54±0.05
(C
ontact pos.)
D±0.2
+0.2
C
-0.3
E
+0.3
0
G
F
2.54±0.1
14.5
2-
Æ
3.2
1.5
4.0
G
±0.1
2-
Æ
3.2
0.5
3.5
Pin Count
Æ0.9
0
0.5 ±0.1
+0.1
Part Number
Pin Count
IC37NRB-1403-G4
IC37NRB-1404-G4
IC37NRB-1603-G4
IC37NRB-1803-G4
IC37NRB-2003-G4
IC37NRB-2004-G4
IC37NRB-2203-G4
IC37NRB-2204-G4
IC37NRB-2403-G4
IC37NRB-2404-G4
IC37NRB-2406-G4
IC37NRB-2803-G4
IC37NRB-2804-G4
IC37NRB-2806-G4
IC37NRB-3203-G4
IC37NRB-3206-G4
IC37NRB-3204-G4
IC37NRB-4006-G4
IC37NRB-4206-G4
IC37NRB-4806-G4
Test & Burn-In
A
20.04
20.04
22.58
25.12
27.66
27.66
30.20
30.20
32.74
32.74
32.74
37.82
37.82
37.82
42.90
42.90
42.90
53.06
55.60
63.22
B
2.54 x 6 = 15.24
2.54 x 6 = 15.24
2.54 x 7 = 17.78
2.54 x 8 = 20.32
2.54 x 9 = 22.86
2.54 x 9 = 22.86
25.4 x 10 = 25.40
2.54 x 10 = 25.40
2.54 x 11 = 27.94
2.54 x 11 = 27.94
2.54 x 11 = 27.94
2.54 x 13 = 33.02
2.54 x 13 = 33.02
2.54 x 13 = 33.02
2.54 x 15 = 38.10
2.54 x 15 = 38.10
2.54 x 15 = 38.10
2.54 x 19 = 48.26
2.54 x 20 = 50.80
2.54 x 23 = 58.42
C
17.0
19.5
17.0
17.0
17.0
19.5
17.0
19.5
17.0
19.5
24.6
17.0
19.5
24.6
17.0
24.6
19.5
24.6
24.6
24.6
D
7.8
10.3
7.8
7.8
7.8
10.3
7.8
10.3
7.8
10.3
15.4
7.8
10.3
15.4
7.8
15.4
10.3
15.4
15.4
15.4
E
2.0
2.9
2.0
2.0
2.0
2.9
2.0
2.9
2.0
2.9
8.0
2.0
2.9
8.0
2.0
8.0
2.9
8.0
8.0
8.0
F
7.5
8.0
7.5
7.5
7.5
8.0
7.5
8.0
7.5
8.0
10.3
7.5
8.0
10.3
7.5
10.3
8.0
10.3
10.3
10.3
G
11.4
13.9
11.4
11.4
11.4
13.9
11.4
13.9
11.4
13.9
19.0
11.4
13.9
19.0
11.4
19.0
13.9
19.0
19.0
19.0
H
–
–
–
–
–
–
–
–
–
–
6.21
–
–
6.21
–
8.75
–
13.83
15.10
16.37
J
–
–
–
–
–
–
–
–
–
–
20.32
–
–
25.40
–
25.40
–
25.40
25.40
30.48
14
14
16
18
20
20
22
22
24
24
24
28
28
28
32
32
32
40
42
48
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Microcontroller MCU
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