Serial I/O Controller, 1 Channel(s), CMOS, CDIP28, GLASS SEALED, DIP-28
| Parameter Name | Attribute value |
| Maker | Intel |
| Parts packaging code | DIP |
| package instruction | DIP, |
| Contacts | 28 |
| Reach Compliance Code | unknown |
| Address bus width | 3 |
| boundary scan | NO |
| maximum clock frequency | 18.43 MHz |
| letter of agreement | ASYNC, BIT |
| External data bus width | 8 |
| JESD-30 code | R-GDIP-T28 |
| low power mode | YES |
| Number of serial I/Os | 1 |
| Number of terminals | 28 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B |
| Maximum supply voltage | 5.5 V |
| Minimum supply voltage | 4.5 V |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | THROUGH-HOLE |
| Terminal location | DUAL |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| MD82510/B | TN82510 | MR82510/B | TP82510 | |
|---|---|---|---|---|
| Description | Serial I/O Controller, 1 Channel(s), CMOS, CDIP28, GLASS SEALED, DIP-28 | Serial I/O Controller, 1 Channel(s), 0.03515625MBps, CMOS, PQCC28, PLASTIC, LCC-28 | Serial I/O Controller, 1 Channel(s), CMOS, CQCC28, CERAMIC, LCC-28 | Serial I/O Controller, 1 Channel(s), 0.03515625MBps, CMOS, PDIP28, DIP-28 |
| Parts packaging code | DIP | QLCC | QLCC | DIP |
| package instruction | DIP, | PLASTIC, LCC-28 | QCCN, | DIP, DIP28,.6 |
| Contacts | 28 | 28 | 28 | 28 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Maker | Intel | - | Intel | Intel |
| Address bus width | 3 | 3 | - | 3 |
| boundary scan | NO | NO | - | NO |
| maximum clock frequency | 18.43 MHz | 18.432 MHz | - | 18.432 MHz |
| letter of agreement | ASYNC, BIT | ASYNC, BIT | - | ASYNC, BIT |
| External data bus width | 8 | 8 | - | 8 |
| JESD-30 code | R-GDIP-T28 | R-PQCC-J28 | - | R-PDIP-T28 |
| low power mode | YES | YES | - | YES |
| Number of serial I/Os | 1 | 1 | - | 1 |
| Number of terminals | 28 | 28 | - | 28 |
| Maximum operating temperature | 125 °C | 85 °C | - | 85 °C |
| Minimum operating temperature | -55 °C | -40 °C | - | -40 °C |
| Package body material | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
| encapsulated code | DIP | QCCJ | - | DIP |
| Package shape | RECTANGULAR | RECTANGULAR | - | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | - | IN-LINE |
| Certification status | Not Qualified | Not Qualified | - | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | - | 5 V |
| surface mount | NO | YES | - | NO |
| technology | CMOS | CMOS | - | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | - | INDUSTRIAL |
| Terminal form | THROUGH-HOLE | J BEND | - | THROUGH-HOLE |
| Terminal location | DUAL | QUAD | - | DUAL |
| uPs/uCs/peripheral integrated circuit type | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
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