IC553 Series
Specifications
Insulation Resistance:
Dielectric Withstanding Voltage:
Contact Resistance:
Operating Temperature Range:
Mating Cycles:
Pin Count:
Dual Inline Memory Module
(DIMM, 160 pins)
Part Number
(Details)
1,000M
W
min. at 500V DC
700V AC for 1 minute
30m
W
max. at 10mA/20mV max.
–55°C to +170°C
10,000 insertions min.
160 contact pins
IC-553
-
1
-
MF
Series No.
Design No.
MF = Flanged
Unmarked = Not Flanged
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Features
í
Card thickness 1.57mm
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
141.00 ±0.1
102.87 ±0.2
1.27x37=46.99 ±0.2
Æ3.20
Thru hole
3.81 Ref
2.54
1.27x41=52.07 ±0.2
1.27x37=46.99 ±0.1
1.27±0.05
102.87 ±0.1
1.27x41=52.07 ±0.1
(3.81)
160-
Æ
0.80
+ 0.1
0
17.00
13.00
8.58±0.05
1.27 ±0.1
108.00
+ 0.2
0
1.27 ±0.1
132.00 ±0.4
141.00 ±0.2
150.00 ±0.4
5.38±0.05
1.27 ±0.05
Æ3.20
+ 0.1
0
Matching Module Dimensions
110.50
1.50
+0
0.1
+ 0.2
0
1.88 ±0.05
R 0.75
+ 0.26
28.70
– 0.25
19.00
11.00
4.00
3.70 ±0.5
w0.40 x t0.30
46.99
102.87
104.65 Ref
110.24
+ 0.26
– 0.25
52.07
1.57
±0.15
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Test & Burn-In
B-3
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