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74HC3G07DC

Description
Buffer, CMOS, PDSO8,
Categorylogic    logic   
File Size75KB,14 Pages
ManufacturerPhilips Semiconductors (NXP Semiconductors N.V.)
Websitehttps://www.nxp.com/
Environmental Compliance
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74HC3G07DC Overview

Buffer, CMOS, PDSO8,

74HC3G07DC Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPhilips Semiconductors (NXP Semiconductors N.V.)
package instructionTSSOP, TSSOP8,.12,20
Reach Compliance Codeunknown
JESD-30 codeR-PDSO-G8
Load capacitance (CL)50 pF
Logic integrated circuit typeBUFFER
MaximumI(ol)0.004 A
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristicsOPEN-DRAIN
Package body materialPLASTIC/EPOXY
encapsulated codeTSSOP
Encapsulate equivalent codeTSSOP8,.12,20
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packingTAPE AND REEL
power supply2/6 V
Prop。Delay @ Nom-Sup30 ns
Certification statusNot Qualified
Schmitt triggerNO
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
INTEGRATED CIRCUITS
DATA SHEET
74HC3G07; 74HCT3G07
Buffer with open-drain outputs
Product specification
2003 Oct 15

74HC3G07DC Related Products

74HC3G07DC 74HCT3G07DC 74HCT3G07DP 74HC3G07DP
Description Buffer, CMOS, PDSO8, Buffer, CMOS, PDSO8, Buffer, CMOS, PDSO8, Buffer, CMOS, PDSO8,
Is it Rohs certified? conform to conform to incompatible incompatible
Maker Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.) Philips Semiconductors (NXP Semiconductors N.V.)
package instruction TSSOP, TSSOP8,.12,20 TSSOP, TSSOP8,.12,20 TSSOP, TSSOP8,.16 TSSOP, TSSOP8,.16
Reach Compliance Code unknown unknown unknown unknown
JESD-30 code R-PDSO-G8 R-PDSO-G8 R-PDSO-G8 R-PDSO-G8
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUFFER BUFFER BUFFER BUFFER
MaximumI(ol) 0.004 A 0.004 A 0.004 A 0.004 A
Number of terminals 8 8 8 8
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Output characteristics OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN OPEN-DRAIN
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSSOP TSSOP TSSOP TSSOP
Encapsulate equivalent code TSSOP8,.12,20 TSSOP8,.12,20 TSSOP8,.16 TSSOP8,.16
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
method of packing TAPE AND REEL TAPE AND REEL TAPE AND REEL TAPE AND REEL
power supply 2/6 V 5 V 5 V 2/6 V
Prop。Delay @ Nom-Sup 30 ns 32 ns 32 ns 30 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Schmitt trigger NO NO NO NO
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal form GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.635 mm 0.635 mm
Terminal location DUAL DUAL DUAL DUAL
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