FIFO, 64X5, 81ns, Asynchronous, CMOS, PDSO20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | SOP, SOP20,.4 |
| Reach Compliance Code | unknown |
| Maximum access time | 81 ns |
| Maximum clock frequency (fCLK) | 14 MHz |
| JESD-30 code | R-PDSO-G20 |
| JESD-609 code | e0 |
| Memory IC Type | OTHER FIFO |
| memory width | 5 |
| Number of terminals | 20 |
| word count | 64 words |
| character code | 64 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 64X5 |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP20,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| power supply | 2/6 V |
| Certification status | Not Qualified |
| Maximum slew rate | 0.0005 mA |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| 74HC7404T | 74HCT7404P | 74HCT7404T | 74HC7404P | |
|---|---|---|---|---|
| Description | FIFO, 64X5, 81ns, Asynchronous, CMOS, PDSO20 | FIFO, 64X5, 90ns, Asynchronous, CMOS, PDIP18 | FIFO, 64X5, 90ns, Asynchronous, CMOS, PDSO20 | FIFO, 64X5, 81ns, Asynchronous, CMOS, PDIP18 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | SOP, SOP20,.4 | DIP, DIP18,.3 | SOP, SOP20,.4 | DIP, DIP18,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Maximum access time | 81 ns | 90 ns | 90 ns | 81 ns |
| Maximum clock frequency (fCLK) | 14 MHz | 14 MHz | 14 MHz | 14 MHz |
| JESD-30 code | R-PDSO-G20 | R-PDIP-T18 | R-PDSO-G20 | R-PDIP-T18 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Memory IC Type | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| memory width | 5 | 5 | 5 | 5 |
| Number of terminals | 20 | 18 | 20 | 18 |
| word count | 64 words | 64 words | 64 words | 64 words |
| character code | 64 | 64 | 64 | 64 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 70 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | - | -40 °C | -40 °C |
| organize | 64X5 | 64X5 | 64X5 | 64X5 |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | SOP | DIP | SOP | DIP |
| Encapsulate equivalent code | SOP20,.4 | DIP18,.3 | SOP20,.4 | DIP18,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| power supply | 2/6 V | 5 V | 5 V | 2/6 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | NO | YES | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum slew rate | 0.0005 mA | - | 0.0005 mA | 0.0005 mA |
京公网安备 11010802033920号
EEWORLD
