Inverter, CMOS, PDIP20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T20 |
| JESD-609 code | e0 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | INVERTER |
| Number of terminals | 20 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP20,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 2/6 V |
| Prop。Delay @ Nom-Sup | 26 ns |
| Certification status | Not Qualified |
| Schmitt trigger | YES |
| surface mount | NO |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| PC74HC9014P | 74HCT9014D | PC74HCT9014T | PC74HC9014T | |
|---|---|---|---|---|
| Description | Inverter, CMOS, PDIP20 | Inverter, CMOS, PDSO20, | Inverter, CMOS, PDSO20 | Inverter, CMOS, PDSO20 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP20,.3 | SOP, SOP20,.4 | SOP, SOP20,.4 | SOP, SOP20,.4 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER | INVERTER |
| Number of terminals | 20 | 20 | 20 | 20 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | SOP | SOP | SOP |
| Encapsulate equivalent code | DIP20,.3 | SOP20,.4 | SOP20,.4 | SOP20,.4 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| power supply | 2/6 V | 5 V | 5 V | 2/6 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | YES | YES | YES | YES |
| surface mount | NO | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Load capacitance (CL) | 50 pF | - | 50 pF | 50 pF |
| Prop。Delay @ Nom-Sup | 26 ns | - | 40 ns | 26 ns |
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