Multiplexer, 1-Func, 8 Line Input, TTL, PDIP16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknown |
| JESD-30 code | R-PDIP-T16 |
| JESD-609 code | e0 |
| Logic integrated circuit type | MULTIPLEXER |
| MaximumI(ol) | 0.02 A |
| Number of functions | 1 |
| Number of entries | 8 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Maximum supply current (ICC) | 85 mA |
| Prop。Delay @ Nom-Sup | 19.5 ns |
| Certification status | Not Qualified |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | TTL |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| N74S251N | 54S251/BEA | N74LS251D-T | N74LS251AN-B | N74LS251AF | N74LS251N-B | N74LS251N | 54S251/BFA | N74S251N-B | |
|---|---|---|---|---|---|---|---|---|---|
| Description | Multiplexer, 1-Func, 8 Line Input, TTL, PDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, CDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, PDSO16 | Multiplexer, 1-Func, 8 Line Input, TTL, PDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, CDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, PDIP16 | Multiplexer, 1-Func, 8 Line Input, TTL, PDIP16, | Multiplexer, 1-Func, 8 Line Input, TTL, CDFP16 | Multiplexer, 1-Func, 8 Line Input, TTL, PDIP16 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | DIP, DIP16,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | R-PDIP-T16 | R-XDIP-T16 | R-PDSO-G16 | R-PDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-PDIP-T16 | R-XDFP-F16 | R-PDIP-T16 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of entries | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of terminals | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| Maximum operating temperature | 70 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 125 °C | 70 °C |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | SOP | DIP | DIP | DIP | DIP | DFP | DIP |
| Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | SOP16,.25 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | FL16,.3 | DIP16,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | FLATPACK | IN-LINE |
| power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | YES | NO | NO | NO | NO | YES | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| MaximumI(ol) | 0.02 A | 0.02 A | 0.008 A | - | - | 0.008 A | 0.008 A | 0.02 A | 0.02 A |
| Maximum supply current (ICC) | 85 mA | 85 mA | 12 mA | - | - | 12 mA | 12 mA | 85 mA | 85 mA |
| Prop。Delay @ Nom-Sup | 19.5 ns | 19.5 ns | 45 ns | - | - | 45 ns | 45 ns | 19.5 ns | 19.5 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
京公网安备 11010802033920号
EEWORLD
