DM74LS22N/A+ datasheet, PDF - EEWORLD Datasheet

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DM74LS22N/A+: DescriptionIC,LOGIC GATE,DUAL 4-INPUT NAND,LS-TTL,DIP,14PIN,PLASTIC; Categorylogic logic; File Size138KB，3 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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DM74LS22N/A+ Overview

IC,LOGIC GATE,DUAL 4-INPUT NAND,LS-TTL,DIP,14PIN,PLASTIC

DM74LS22N/A+ Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Texas Instruments
package instruction	DIP, DIP14,.3
Reach Compliance Code	unknown
JESD-30 code	R-PDIP-T14
JESD-609 code	e0
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.008 A
Number of terminals	14
Maximum operating temperature	70 °C
Minimum operating temperature
Output characteristics	OPEN-COLLECTOR
Package body material	PLASTIC/EPOXY
encapsulated code	DIP
Encapsulate equivalent code	DIP14,.3
Package shape	RECTANGULAR
Package form	IN-LINE
power supply	5 V
Prop。Delay @ Nom-Sup	32 ns
Schmitt trigger	NO
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	TTL
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL

DM74LS22N/A+ Related Products

	DM74LS22N/A+	DM54LS22W	DM74LS22N	DM74LS22J/A+
Description	IC,LOGIC GATE,DUAL 4-INPUT NAND,LS-TTL,DIP,14PIN,PLASTIC	IC,LOGIC GATE,DUAL 4-INPUT NAND,LS-TTL,FP,14PIN,CERAMIC	LS SERIES, DUAL 4-INPUT NAND GATE, PDIP14	IC,LOGIC GATE,DUAL 4-INPUT NAND,LS-TTL,DIP,14PIN,CERAMIC
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
package instruction	DIP, DIP14,.3	DFP, FL14,.3	DIP, DIP14,.3	DIP, DIP14,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	R-PDIP-T14	R-XDFP-F14	R-PDIP-T14	R-XDIP-T14
JESD-609 code	e0	e0	e0	e0
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE
MaximumI(ol)	0.008 A	0.004 A	0.008 A	0.008 A
Number of terminals	14	14	14	14
Maximum operating temperature	70 °C	125 °C	70 °C	70 °C
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR	OPEN-COLLECTOR
Package body material	PLASTIC/EPOXY	CERAMIC	PLASTIC/EPOXY	CERAMIC
encapsulated code	DIP	DFP	DIP	DIP
Encapsulate equivalent code	DIP14,.3	FL14,.3	DIP14,.3	DIP14,.3
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE	FLATPACK	IN-LINE	IN-LINE
power supply	5 V	5 V	5 V	5 V
Prop。Delay @ Nom-Sup	32 ns	32 ns	24 ns	32 ns
Schmitt trigger	NO	NO	NO	NO
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	NO	YES	NO	NO
technology	TTL	TTL	TTL	TTL
Temperature level	COMMERCIAL	MILITARY	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	THROUGH-HOLE	FLAT	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	2.54 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maker	Texas Instruments	-	Texas Instruments	Texas Instruments

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