Ceramic Chip–on–Board Mixer Quads
Features
For Microwave MIC Assembly &
Automated High Volume Manufacturing Lines
Mechanically Rugged Design
Three Barrier Heights for Optimized
Mixer Performance
Automated Assembly Methods
100% DC Tested
Back to Back
Crossover Quad
S–Band Crossover Ring Quad
Chip–on–Board
3
Maximum Ratings
T
STG
:
T
OP
:
P
DISS
CW:
I
MAX
:
PIV:
–65°C to +175°C
–65°C to +150°C
75 mW/junction
50 mA
2.0 V at 10
µA
Description
The Ceramic Chip–on–Board (COB) Mixer Quads
are designed for a high degree of device reliability
and ease of use in both commercial and industrial
applications. They are designed to offer the utmost in
performance while achieving price targets for cost
sensitive commercial systems.
Electrical Specifications
1
at 25°C
Part
Number
N b
Ring Quad
DMF3926–101
DME3927–101
DMJ3928–101
Low
Medium
High
220
300
525
290
400
625
–
–
–
–
–
–
–
390
600
–
470
700
10
15
15
0.55
0.55
0.55
0.07
0.07
0.07
8
8
8
101
101
101
V
F
I
F
= 1 mA
(mV)
Barrier
B i
Min
Max
V
F
I
F
= 5 mA
(mV)
Min
Max
V
F
I
F
= 10 mA
(mV)
Min
Max
D
V
F 2
I
F
= 10 mA
(mV)
Min
C
T
V
R
= 0V, f = 1 MHz
(pF)
Max
D
C
T3
V
R
= 0V, f = 1 MHz
(pF)
Max
R
T
I
F
= 10 mA
(Ohms)
Max
Outline
Drawing
Number
N
b
Crossover Ring Quad
DMF3926–100
DME3927–100
DMJ3928–100
Low
Medium
High
220
300
525
290
400
625
260
–
–
330
–
–
–
390
600
–
470
700
10
15
15
0.55
0.55
0.55
0.07
0.07
0.07
8
8
8
100
100
100
Back–to–Back Crossover Quad
DMF3929–103
DME3930–103
DMJ3931–103
Low
Medium
High
220
300
525
290
400
625
260
–
–
330
–
–
–
360
600
–
480
700
15
15
20
0.55
0.55
0.55
0.07
0.07
0.07
8
8
8
103
103
103
1. Parameters are for each junction.
2. Forward voltage difference.
3. Capacitance difference.
Alpha Industries
•
[617] 935 5150
•
Fax
[617] 824 4579
•
E-mail
sales@alphaind.com
•
Visit our web site:
www.alphaind.com
3–7
DSP and ARM Processors
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