hochtemperaturbeständig, Liefermöglichkeiten auf Anfrage
Standard /
Standard
Mounting Type
/
Befestigungsarten
W
T
Z
Float mounted (see page 15)
/
Schwimmend (siehe Seite15)
Clinch nut 4-40 UNC (see page 59)
/
Einnietmutter 4-40 UNC (siehe Seite 59)
Clinch nut M3 (see page 59)
/
Einnietmutter M3 (siehe Seite 59)
Einnietmutter 4-40 UNC, selbstsichernd (siehe Seite 59)
Einnietmutter M3, selbstsichernd (siehe Seite 59)
TS
Clinch nut 4-40 UNC, self locking (see page 59)
ZS
Clinch nut M3, self locking (see page 59)
No. of Contacts /
Polzahl
Shell size /
Gehäusegröße
09
1
15
2
25
3
37
4
50
5
Contact Type /
Kontaktart
P
Pin contacts /
Stiftkontakte
S
Socket contacts /
Buchsenkontakte
Contact Design (e. g.)
/
Kontaktvariante (z. B.)
0
1
4
5
14
Solder pot
/
Löttopf
Straight PCB termination /
Leiterplattenanschluss, gerade
Wire-wrap /
Wire Wrap
Right angled PCB termination /
Leiterplattenanschluss, abgewinkelt
Straight PCB termination
/
Leiterplattenanschluss, gerade
For more contacts see page 16 onwards
/
Weitere Kontakte siehe Seite 16 ff.
Machined contacts /
Gedrehte Kontakte
S
Stamped contacts
/
Gestanzte Kontakte
Direction of Right Angled Contacts
/
Richtung der abgewinkelten Kontakte
Standard /
Standard
R
Reverse (Not available with stamped contacts)
/
Revers (nicht mit gestanzten Kontakten möglich)
Performance Classes Available in Accordance with DIN 41652
/
Lieferbare Gütestufen nach DIN 41652
Standard insulator /
Standardisolierkörper
G1
= 500 Contact cycles
/
Steckzyklen
= Performance class 1
/
Gütestufe 1
G2
= 200 Contact cycles
/
Steckzyklen
= Performance class 2
/
Gütestufe 2
G3
= 50 Contact cycles
/
Steckzyklen
= Performance class 3
/
Gütestufe 3
Pin connector with dimples
/
Stiftsteckverbinder mit Kontaktnoppen
FM insulator /
FM-Isolierkörper
All connectors are in accordance with the standards of performance class 1; no performance class
number necessary! (1.3 µm (51 microinches) Au over Ni)
Alle Steckverbinder erfüllen die Anforderungen der Gütestufe 1; Typenbezeichnung ohne Gütestufen!
(1,3 µm Au über Ni)
Modifications
/
Modifikationen
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
DS 10/2007
9
Technical Data
Technische Daten
Mechanical Data
Mechanische Daten
Mechanical Data
Mechanische Daten
Mating force per signal contact
Steckkraft pro Signalkontakt
Unmating force per signal contact
Ziehkraft pro Signalkontakt
max. torque *
max. Anzugsmoment *
* Not for locking screws
* Nicht für Verriegelungsschrauben
3,4 N
0,2 N
40 Ncm (0,295 ft.lb.)
40 Ncm
Electrical Data
Elektrische Daten
Electrical Data
Elektrische Daten
Current rating at room temperature
Maximale Stromstärke bei Raumtemperatur
Test voltage between 2 contacts / shell and contact
Prüfspannung zwischen 2 Kontakten bzw. Kontakt und Gehäuse
Meets transition resistance requirements per contact pair in line with DIN 41652:
Erfüllt Übergangswiderstand pro Kontaktpaar nach DIN 41652 für:
- Straight contacts
/
gerade Kontakte
- Right angled contacts
/
abgewinkelte Kontakte
- Right angled contacts - 50 way
/
abgewinkelte Kontakte bei 50 Polen
Insulation resistance between contacts
Isolationswiderstand Kontakt / Kontakt
Volume resistivity
Spezifischer Durchgangswiderstand
Dielectric strength
Spezifische Durchschlagsfestigkeit
5A
1200 V / 1 min.
10 m
25 m
35 m
5000 M
10
16
cm
50 kV / mm
Materials and Platings
Materialien und Oberflächen
Materials and Platings
Materialien und Oberflächen
Shell
Gehäuse
Type /
Type
Insulator
Isolierkörper
Steel
Stahl
FH
Polyester, heat resistant,
glass filled (UL94V-0), natural
Polyester,
hochtemperaturbeständig,
glasfaserverstärkt (UL94V-0), natur
150 °C (302 °F)
F
Polyester, glass filled
(UL94V-0), white
Polyester, glasfaserverstärkt
(UL94V-0), weiß
FM
Polyester, glass filled (UL94V-0),
green
Polyester, glasfaserverstärkt
(UL94V-0), grün
Relative temperature index according
to UL 746 B
rel.
Temperaturindex nach
UL 746 B
Heat deflection temperature limit
according to DIN 53461 HDT/A
Formbeständigkeitstemperatur nach
DIN 53461 HDT/A
Sub temperature limit
Untere Grenztemperatur
Shell plating (standard)
Gehäuseoberfläche (Standard)
Shell (standard)
Gehäuse (Standard)
Shell (K120)
Gehäuse (K120)
125 °C (257 °F)
130 °C (266 °F)
200 °C (392 °F)
255 °C ( 491 °F)
210 °C (410 °F)
-55 °C (-67 °F)
Tin plated over nickel
verzinnt über Nickel
-55 °C (-67 °F)
-55 °C (-67 °F)
Yellow chromate over zinc plating
Not RoHS compliant
verzinkt und gelb chromatiert
nicht RoHS konform
Pin connector shell without dimples
Stiftsteckverbindergehäuse ohne
Kontaktnoppen
Tin plated over nickel, pin connector
shell
with
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
mit
Kontaktnoppen
Tin plated over nickel, pin connector
shell
without
dimples
verzinnt über Nickel,
Stiftsteckverbindergehäuse
ohne
Kontaktnoppen
Pin connector shell with dimples
Stiftsteckverbindergehäuse mit Kontaktnoppen
Shell (K121)
Gehäuse (K121)
Contact material
Kontaktmaterial
Copper alloy
Kupfer-Legierung
10
DS 10/2007
TECHNISCHE ÄNDERUNGEN VORBEHALTEN – MAßE IN MILLIMETER (INCHES IN KLAMMERN)
Technical Data
Technische Daten
Modifications
Modifikationen
All FCT D-Sub connectors (including crimp versions etc.) are available in many different combinations of materials and platings. For example, shells can
be supplied in a non – magnetic version made of brass, which can be electroless nickel, or gold plated for use in aerospace technology.
Alle FCT D-Sub Steckverbinder (auch Crimp Versionen, usw.) sind in vielen verschiedenen Material- und Oberflächenkombinationen erhältlich. So z. B.
Gehäuse in nichtmagnetischer Ausführung aus Messing bzw. chemisch vernickelte oder vergoldete Gehäuse für Luft- und Raumfahrtanwendungen.
Contact Arrangements
Polbilder
Face view of socket connector
Blick auf Steckseite Buchsensteckverbinder
Face view of pin connector
Blick auf Steckseite Stiftsteckverbinder
Shell Size
Gehäusegröße
Number of Contacts
Polzahl
Pin Connector, Connecting Side
Stiftsteckverbinder, Ansicht steckseitig
1
9
2
15
3
25
4
37
5
50
DS 10/2007
ALL DIMENSIONS IN MILLIMETERS - VALUES FOR INCHES IN BRACKETS - TECHNICAL DATA SUBJECT TO CHANGE
[i=s]This post was last edited by dontium on 2015-1-23 11:34[/i]Digital logic has become the core of all electronic circuits today, whether it is an FPGA, a microcontroller, a microprocessor or discre...
When I use the simulator , every time I click Debug without downloading, a user error:illeagl opcode found at address 0x0 pops up. I tried the program that I debugged successfully before , but it stil...
[i=s]This post was last edited by qwqwqw2088 on 2020-9-27 08:46[/i]According to the PMBUS 1.3.1 version protocol, Section 2, Part 8.2, this article will briefly describe how to dynamically adjust the ...
[i=s] This post was last edited by fjjjnk1234 on 2014-8-3 16:46 [/i] [align=center][size=5]HELPER2416 Study Notes 6 - UART [/size][/align] [align=center][color=red][font=宋体][size=10.0pt]Participate [/...
[i=s] This post was last edited by paulhyde on 2014-9-15 08:52 [/i] I need help. Does anyone know if there is an A/D chip that can work with 12V voltage and can input analog values > 5V? I am working ...
Assume that data is read from 8-bit AD (if it is a higher-bit AD, the data type can be defined as int), the subroutine is get_ad();
1. Limited secondary filtering
/* A value can be adjust...[Details]
Microchip's PIC18F46J50 is a low-power, high-performance 8-bit USB microcontroller (MCU) using nanoWatt XLP technology. The current in deep sleep mode can be as low as 13nA, the operating voltage i...[Details]
1 Introduction
A wide variety of communication cables and control cables are widely used in various instruments and control equipment. Whether the cable is well-conducted and
whether
th...[Details]
As a wireless broadband metropolitan area network standard, WiMAX technology has greater advantages than previous 3.5GHz MMDS products in terms of non-line-of-sight transmission and spectrum utiliz...[Details]
0 Introduction
With the development of my country's economy, the number of motor vehicles continues to increase. The growth of existing roads and other hardware facilities can no longer meet t...[Details]
Floating-point digital signal processing has become a constant requirement for precision technology, often in applications requiring high accuracy in areas such as aviation, industrial machinery, a...[Details]
introduction
In the discharge process of tokamak plasma physics, the study of rupture and sawtooth is of great significance. Rupture and sawtooth exist in most tokamaks. Rupture is a notew...[Details]
In this article, the high-performance DSP developed by TI can be used as an effective confidentiality method if it is applied to PC encryption cards.
As an effective network security solution,...[Details]
1 Introduction
Solar street lights are mainly composed of four parts: solar photovoltaic cell components, batteries, charge and discharge controllers, and lighting fixtures. The bo...[Details]
Two simple circuits are implemented to drive two LEDs from a battery powered microprocessor.
This design is based on a circuit that uses three resistors and a microprocessor I/O pin as an input h...[Details]
1. Principle of displacement angle sensor
The angle sensor is used to detect angles. It has a hole in its body that fits the LEGO axle. When connected to the RCX, the angle sensor counts once ...[Details]
Microcalorimetry
is used to determine energy relationships. Microcalorimetry techniques are often required when performing calorimetric experiments with small sample sizes or slow heating rat...[Details]
Contact resistance
is the resistance to current flow through a closed pair of contacts. This type of measurement is performed on devices such as connectors,
relays
, and switches. The...[Details]
1 Introduction to HART Protocol
HART (Highway Addressable Remote Transducer), an open communication protocol for addressable remote sensor high-speed channels, was launched by Rosemen in the U...[Details]
MediaTek (2454) announced the acquisition of F-MStar (3697) and attracted the attention of IC design industry. This morning, Gartner Semiconductor Industry Research Director Hong Cenwei analyzed ...[Details]