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DS2155L

Description
DATACOM, FRAMER, PQFP100, 14 X 14 MM, LQFP-100
CategoryWireless rf/communication    Telecom circuit   
File Size3MB,239 Pages
ManufacturerRochester Electronics
Websitehttps://www.rocelec.com/
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DS2155L Overview

DATACOM, FRAMER, PQFP100, 14 X 14 MM, LQFP-100

DS2155L Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerRochester Electronics
Parts packaging codeQFP
package instructionLFQFP,
Contacts100
Reach Compliance Codeunknown
JESD-30 codeS-PQFP-G100
JESD-609 codee0
length14 mm
Humidity sensitivity level3
Number of functions1
Number of terminals100
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeLFQFP
Package shapeSQUARE
Package formFLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)240
Certification statusCOMMERCIAL
Maximum seat height1.6 mm
Nominal supply voltage3.3 V
surface mountYES
Telecom integrated circuit typesFRAMER
Temperature levelCOMMERCIAL
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationQUAD
Maximum time at peak reflow temperature20
width14 mm
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DS2155L Related Products

DS2155L DS2155G
Description DATACOM, FRAMER, PQFP100, 14 X 14 MM, LQFP-100 DATACOM, FRAMER, PBGA100, 10 X 10 MM, 0.80 MM PITCH, CSBGA-100
Is it lead-free? Contains lead Contains lead
Is it Rohs certified? incompatible incompatible
Maker Rochester Electronics Rochester Electronics
Parts packaging code QFP BGA
package instruction LFQFP, FBGA,
Contacts 100 100
Reach Compliance Code unknown unknown
JESD-30 code S-PQFP-G100 S-PBGA-B100
length 14 mm 10 mm
Humidity sensitivity level 3 3
Number of functions 1 1
Number of terminals 100 100
Maximum operating temperature 70 °C 70 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFQFP FBGA
Package shape SQUARE SQUARE
Package form FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Celsius) 240 240
Certification status COMMERCIAL COMMERCIAL
Nominal supply voltage 3.3 V 3.3 V
surface mount YES YES
Telecom integrated circuit types FRAMER FRAMER
Temperature level COMMERCIAL COMMERCIAL
Terminal surface TIN LEAD NOT SPECIFIED
Terminal form GULL WING BALL
Terminal pitch 0.5 mm 0.8 mm
Terminal location QUAD BOTTOM
Maximum time at peak reflow temperature 20 20
width 14 mm 10 mm
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