LH538R00BSR datasheet, PDF - EEWORLD Datasheet

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LH538R00BSR: DescriptionMASK ROM, 1MX8, 120ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32; Categorystorage storage; File Size125KB，6 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LH538R00BSR Overview

MASK ROM, 1MX8, 120ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32

LH538R00BSR Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	SHARP
package instruction	0.400 INCH, PLASTIC, REVERSE, TSOP2-32
Reach Compliance Code	unknown
Maximum access time	120 ns
JESD-30 code	R-PDSO-G32
JESD-609 code	e0
length	21 mm
memory density	8388608 bit
Memory IC Type	MASK ROM
memory width	8
Number of functions	1
Number of terminals	32
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TSOP2-R
Package shape	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10.2 mm

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LH538R00BSR Related Products

	LH538R00BSR	LH538R00BS	LH538R00BN	LH538R00BD
Description	MASK ROM, 1MX8, 120ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, REVERSE, TSOP2-32	MASK ROM, 1MX8, 120ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP2-32	MASK ROM, 1MX8, 120ns, CMOS, PDSO32, 0.525 INCH, PLASTIC, SOP-32	MASK ROM, 1MX8, 120ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible
Maker	SHARP	SHARP	SHARP	SHARP
package instruction	0.400 INCH, PLASTIC, REVERSE, TSOP2-32	0.400 INCH, PLASTIC, TSOP2-32	0.525 INCH, PLASTIC, SOP-32	0.600 INCH, PLASTIC, DIP-32
Reach Compliance Code	unknown	unknown	unknown	unknown
Maximum access time	120 ns	120 ns	120 ns	120 ns
JESD-30 code	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDIP-T32
JESD-609 code	e0	e0	e0	e0
length	21 mm	21 mm	20.6 mm	41 mm
memory density	8388608 bit	8388608 bit	8388608 bit	8388608 bit
Memory IC Type	MASK ROM	MASK ROM	MASK ROM	MASK ROM
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	32	32	32	32
word count	1048576 words	1048576 words	1048576 words	1048576 words
character code	1000000	1000000	1000000	1000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C
organize	1MX8	1MX8	1MX8	1MX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TSOP2-R	TSOP2	SOP	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	3.1 mm	5.2 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V
surface mount	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	10.2 mm	10.2 mm	11.3 mm	15.24 mm

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