LRS1331C datasheet, PDF - EEWORLD Datasheet

LRS1331C: DescriptionMemory Circuit, 1MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72; Categorystorage storage; File Size867KB，39 Pages; ManufacturerSHARP; Websitehttp://sharp-world.com/products/device/

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LRS1331C Overview

Memory Circuit, 1MX16, CMOS, PBGA72, 8 X 11 MM, PLASTIC, CSP-72

Parameter Name	Attribute value
Maker	SHARP
package instruction	8 X 11 MM, PLASTIC, CSP-72
Reach Compliance Code	unknown
Other features	ALSO CONTAINS 4 MBIT SRAM
JESD-30 code	R-PBGA-B72
length	11 mm
memory density	16777216 bit
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	72
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	1MX16
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.4 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	8 mm

RELIMINARY

RODUCT

PECIFICATIONS

Integrated Circuits Group

16M (x16) Flash and 4M (x16) SRAM

(Model No.: LRS1331C)

Stacked Chip

LRS1331C

Spec No.: MFM2-J13603

Issue Date: June 14, 2001

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