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MTB50N06E

Description
50A, 60V, 0.025ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-02, D2PAK-3
CategoryDiscrete semiconductor    The transistor   
File Size32KB,1 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
Download Datasheet Parametric Compare View All

MTB50N06E Overview

50A, 60V, 0.025ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-02, D2PAK-3

MTB50N06E Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMotorola ( NXP )
package instructionSMALL OUTLINE, R-PSSO-G2
Contacts3
Manufacturer packaging codeCASE 418B-02
Reach Compliance Codeunknown
ECCN codeEAR99
Shell connectionDRAIN
ConfigurationSINGLE
Minimum drain-source breakdown voltage60 V
Maximum drain current (Abs) (ID)50 A
Maximum drain current (ID)50 A
Maximum drain-source on-resistance0.025 Ω
FET technologyMETAL-OXIDE SEMICONDUCTOR
JESD-30 codeR-PSSO-G2
JESD-609 codee0
Number of components1
Number of terminals2
Operating modeENHANCEMENT MODE
Maximum operating temperature150 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Polarity/channel typeN-CHANNEL
Maximum power dissipation(Abs)2.5 W
Certification statusNot Qualified
surface mountYES
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal locationSINGLE
Maximum time at peak reflow temperatureNOT SPECIFIED
Transistor component materialsSILICON

MTB50N06E Related Products

MTB50N06E MTB15N06ET4 MTB50N06ET4
Description 50A, 60V, 0.025ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-02, D2PAK-3 15 A, 60 V, 0.12 ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-02, D2PAK-3 50 A, 60 V, 0.025 ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-02, D2PAK-3
package instruction SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2 SMALL OUTLINE, R-PSSO-G2
Contacts 3 3 3
Manufacturer packaging code CASE 418B-02 CASE 418B-02 CASE 418B-02
Reach Compliance Code unknown unknown unknown
Shell connection DRAIN DRAIN DRAIN
Configuration SINGLE SINGLE SINGLE
Minimum drain-source breakdown voltage 60 V 60 V 60 V
Maximum drain current (ID) 50 A 15 A 50 A
Maximum drain-source on-resistance 0.025 Ω 0.12 Ω 0.025 Ω
FET technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JESD-30 code R-PSSO-G2 R-PSSO-G2 R-PSSO-G2
Number of components 1 1 1
Number of terminals 2 2 2
Operating mode ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
Package shape RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Polarity/channel type N-CHANNEL N-CHANNEL N-CHANNEL
Certification status Not Qualified Not Qualified Not Qualified
surface mount YES YES YES
Terminal form GULL WING GULL WING GULL WING
Terminal location SINGLE SINGLE SINGLE
Transistor component materials SILICON SILICON SILICON
Is it Rohs certified? incompatible - incompatible
Maker Motorola ( NXP ) - Motorola ( NXP )
ECCN code EAR99 - EAR99
Maximum drain current (Abs) (ID) 50 A - 50 A
JESD-609 code e0 - e0
Maximum operating temperature 150 °C - 150 °C
Peak Reflow Temperature (Celsius) NOT SPECIFIED - NOT SPECIFIED
Maximum power dissipation(Abs) 2.5 W - 2.5 W
Terminal surface Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
Maximum time at peak reflow temperature NOT SPECIFIED - NOT SPECIFIED
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