50A, 60V, 0.025ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-02, D2PAK-3
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Motorola ( NXP ) |
| package instruction | SMALL OUTLINE, R-PSSO-G2 |
| Contacts | 3 |
| Manufacturer packaging code | CASE 418B-02 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Shell connection | DRAIN |
| Configuration | SINGLE |
| Minimum drain-source breakdown voltage | 60 V |
| Maximum drain current (Abs) (ID) | 50 A |
| Maximum drain current (ID) | 50 A |
| Maximum drain-source on-resistance | 0.025 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 code | R-PSSO-G2 |
| JESD-609 code | e0 |
| Number of components | 1 |
| Number of terminals | 2 |
| Operating mode | ENHANCEMENT MODE |
| Maximum operating temperature | 150 °C |
| Package body material | PLASTIC/EPOXY |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Polarity/channel type | N-CHANNEL |
| Maximum power dissipation(Abs) | 2.5 W |
| Certification status | Not Qualified |
| surface mount | YES |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| Transistor component materials | SILICON |
| MTB50N06E | MTB15N06ET4 | MTB50N06ET4 | |
|---|---|---|---|
| Description | 50A, 60V, 0.025ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-02, D2PAK-3 | 15 A, 60 V, 0.12 ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-02, D2PAK-3 | 50 A, 60 V, 0.025 ohm, N-CHANNEL, Si, POWER, MOSFET, CASE 418B-02, D2PAK-3 |
| package instruction | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 |
| Contacts | 3 | 3 | 3 |
| Manufacturer packaging code | CASE 418B-02 | CASE 418B-02 | CASE 418B-02 |
| Reach Compliance Code | unknown | unknown | unknown |
| Shell connection | DRAIN | DRAIN | DRAIN |
| Configuration | SINGLE | SINGLE | SINGLE |
| Minimum drain-source breakdown voltage | 60 V | 60 V | 60 V |
| Maximum drain current (ID) | 50 A | 15 A | 50 A |
| Maximum drain-source on-resistance | 0.025 Ω | 0.12 Ω | 0.025 Ω |
| FET technology | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
| JESD-30 code | R-PSSO-G2 | R-PSSO-G2 | R-PSSO-G2 |
| Number of components | 1 | 1 | 1 |
| Number of terminals | 2 | 2 | 2 |
| Operating mode | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| Polarity/channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| surface mount | YES | YES | YES |
| Terminal form | GULL WING | GULL WING | GULL WING |
| Terminal location | SINGLE | SINGLE | SINGLE |
| Transistor component materials | SILICON | SILICON | SILICON |
| Is it Rohs certified? | incompatible | - | incompatible |
| Maker | Motorola ( NXP ) | - | Motorola ( NXP ) |
| ECCN code | EAR99 | - | EAR99 |
| Maximum drain current (Abs) (ID) | 50 A | - | 50 A |
| JESD-609 code | e0 | - | e0 |
| Maximum operating temperature | 150 °C | - | 150 °C |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED |
| Maximum power dissipation(Abs) | 2.5 W | - | 2.5 W |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED |