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MB811L643242B-10FN

Description
Synchronous DRAM, 2MX32, 8ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86
Categorystorage    storage   
File Size765KB,45 Pages
ManufacturerFUJITSU
Websitehttp://edevice.fujitsu.com/fmd/en/index.html
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MB811L643242B-10FN Overview

Synchronous DRAM, 2MX32, 8ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86

MB811L643242B-10FN Parametric

Parameter NameAttribute value
MakerFUJITSU
package instructionTSOP2,
Reach Compliance Codeunknown
ECCN codeEAR99
access modeFOUR BANK PAGE BURST
Maximum access time8 ns
Other featuresAUTO/SELF REFRESH
JESD-30 codeR-PDSO-G86
length22.22 mm
memory density67108864 bit
Memory IC TypeSYNCHRONOUS DRAM
memory width32
Number of functions1
Number of ports1
Number of terminals86
word count2097152 words
character code2000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize2MX32
Package body materialPLASTIC/EPOXY
encapsulated codeTSOP2
Package shapeRECTANGULAR
Package formSMALL OUTLINE, THIN PROFILE
Certification statusNot Qualified
Maximum seat height1.2 mm
self refreshYES
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formGULL WING
Terminal pitch0.5 mm
Terminal locationDUAL
width10.16 mm
FUJITSU SEMICONDUCTOR
DATA SHEET
DS05-11052-1E
MEMORY
CMOS
4
×
512 K
×
32 BIT
SYNCHRONOUS DYNAMIC RAM
MB811L643242B
-10/-12/-15/-10L/-12L/-15L
CMOS 4-Bank
×
524,288-Word
×
32 Bit
Synchronous Dynamic Random Access Memory
s
DESCRIPTION
The Fujitsu MB811L643242B is a CMOS Synchronous Dynamic Random Access Memory (SDRAM) containing
67,108,864 memory cells accessible in a 32-bit format. The MB811L643242B features a fully synchronous
operation referenced to a positive edge clock whereby all operations are synchronized at a clock input which
enables high performance and simple user interface coexistence. The MB811L643242B SDRAM is designed to
reduce the complexity of using a standard dynamic RAM (DRAM) which requires many control signal timing
constraints, and may improve data bandwidth of memory as much as 5 times more than a standard DRAM.
The MB811L643242B is ideally suited for workstations, personal computers, laser printers, high resolution graphic
adapters/accelerators and other applications where an extremely large memory and bandwidth are required and
where a simple interface is needed.
s
PRODUCT LINE & FEATURES
Parameter
CL - t
RCD
- t
RP
Clock Frequency
Burst Mode Cycle Time
Access Time from Clock
CL = 2
CL = 3
CL = 2
CL = 3
CL = 2
CL = 3
MB811L643242B
-10/-10L
-12/-12L
-15/-15L
2 - 2 - 2 clk min.
2 - 2 - 2 clk min.
2 - 2 - 2 clk min.
3 - 3 - 3 clk min.
3 - 3 - 3 clk min.
3 - 3 - 3 clk min.
100 MHz max.
84 MHz max.
67 MHz max.
15 ns min.
17 ns min.
20ns min.
10 ns min.
12 ns min.
15 ns min.
8 ns max.
8 ns max.
8 ns max.
8 ns max.
8 ns max.
8 ns max.
130 mA max.
120 mA max.
110 mA max.
2 mA max.(std version) / 1.5 mA max.(L version)
2 mA max.(std. version) / 0.5 mA max.(L version)
Operating Current
Power Down Mode Current (I
CC2P
)
Self Refresh Current (I
CC6
)
Single +2.5 V Supply ±0.2 V tolerance
LVTTL compatible I/O interface
4 K refresh cycles every 64 ms
Four bank operation
Burst read/write operation and burst
read/single write operation capability
• Programmable burst type, burst length, and
CAS latency
• Auto-and Self-refresh (every 15.6
µs)
• CKE power down mode
• Output Enable and Input Data Mask

MB811L643242B-10FN Related Products

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Description Synchronous DRAM, 2MX32, 8ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86 Synchronous DRAM, 2MX32, 8ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86 Synchronous DRAM, 2MX32, 8ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86 Synchronous DRAM, 2MX32, 8ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86 Synchronous DRAM, 2MX32, 8ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86 Synchronous DRAM, 2MX32, 8ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP2-86
Maker FUJITSU FUJITSU FUJITSU FUJITSU FUJITSU FUJITSU
package instruction TSOP2, TSOP2, TSOP2, TSOP2, TSOP2, TSOP2,
Reach Compliance Code unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
access mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Maximum access time 8 ns 8 ns 8 ns 8 ns 8 ns 8 ns
Other features AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 code R-PDSO-G86 R-PDSO-G86 R-PDSO-G86 R-PDSO-G86 R-PDSO-G86 R-PDSO-G86
length 22.22 mm 22.22 mm 22.22 mm 22.22 mm 22.22 mm 22.22 mm
memory density 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
memory width 32 32 32 32 32 32
Number of functions 1 1 1 1 1 1
Number of ports 1 1 1 1 1 1
Number of terminals 86 86 86 86 86 86
word count 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
character code 2000000 2000000 2000000 2000000 2000000 2000000
Operating mode SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Maximum operating temperature 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
organize 2MX32 2MX32 2MX32 2MX32 2MX32 2MX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code TSOP2 TSOP2 TSOP2 TSOP2 TSOP2 TSOP2
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm 1.2 mm
self refresh YES YES YES YES YES YES
Maximum supply voltage (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
Minimum supply voltage (Vsup) 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V 2.3 V
Nominal supply voltage (Vsup) 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V 2.5 V
surface mount YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
width 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm 10.16 mm
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