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SMBJP6KE10C-TP

Description
Trans Voltage Suppressor Diode,
CategoryDiscrete semiconductor    diode   
File Size416KB,5 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

SMBJP6KE10C-TP Overview

Trans Voltage Suppressor Diode,

SMBJP6KE10C-TP Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicro Commercial Components (MCC)
Reach Compliance Codecompliant
ECCN codeEAR99
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
Humidity sensitivity level1
Peak Reflow Temperature (Celsius)260
Maximum time at peak reflow temperature10
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla Street Chatsworth

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SMBJP6KE6.8(C)A
THRU
SMBJP6KE550(C)A
Transient
Voltage Suppressor
6.8 to 550 Volts
600 Watt
DO-214AA
(SMBJ) (LEAD FRAME)
A
Features
Halogen
free available upon request by adding suffix "-HF"
For surface mount applicationsin in or der to optimize board space
Available in both unidirectional and bidirectional construction
and suffix"C" designates bidirectional type
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Fast response time: typical less than 1.0ps from 0 volts to
V
BR
minimum
Low inductance
Excellent clamping capability
UL Recognized File # E331408
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals: solderable per MIL-STD-750, Method 2026
Polarity: Color band denotes posit ive end (cathode)
B
except Bidirectional
Maximum soldering temperature: 260 C for 10 seconds
o
C
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Peak Pulse Current on
I
PP
See Table 1 Note:
2
10/1000us waveform
Peak Pulse Power
P
PP
600W
Note:
2,
Dissipation
Operation And Storage T
J
, T
STG
-55
o
C to
Temperature Range
+175
o
C
Thermal Resistance
R
thJC
25
O
C/W
R
thJL
20
O
C/W
F
H
D
G
E
DIMENSIONS
INCHES
MIN
.160
.130
.006
.030
.200
.079
.075
.002
MM
MIN
4.06
3.30
0.15
0.76
5.08
2.00
1.91
0.05
NOTES:
1.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
DIM
A
B
C
D
E
F
G
H
MAX
.185
.155
.012
.060
.220
.096
.087
.008
MAX
4.70
3.94
0.31
1
..52
5.59
2.44
2.21
0.203
NOTE
2.
Non-repetitive current pulse, per Fig.3 and derated above
o
T
A
=25 C per Fig.2.
SUGGESTED SOLDER
PAD LAYOUT
0.106"
0.082”
0.050”
Revision:
E
www.mccsemi.com
1 of 5
2013/07/18

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