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SMBJ5916

Description
Zener Diode, 4.3V V(Z), 3W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMBJ, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size351KB,2 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric View All

SMBJ5916 Overview

Zener Diode, 4.3V V(Z), 3W, Silicon, Unidirectional, DO-214AA, PLASTIC, SMBJ, 2 PIN

SMBJ5916 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicro Commercial Components (MCC)
Parts packaging codeDO-214AA
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-214AA
JESD-30 codeR-PDSO-C2
JESD-609 codee0
Number of components1
Number of terminals2
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)240
polarityUNIDIRECTIONAL
Maximum power dissipation3 W
Certification statusNot Qualified
Nominal reference voltage4.3 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature30
Working test current87.2 mA
MCC
Features
  omponents
21201 Itasca Street Chatsworth

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$ %    !"#
SMBJ5913
THRU
SMBJ5956
Silicon
3.0 Watt
Zener Diode
DO-214AA
(SMBJ) (Round Lead)
H
Surface Mount Applications
3.3 thru 200 Volt Voltage Range
Ideal For High Density, Low Profile Mounting
Withstands Large Surge Stresses
Available on Tape and Reel
Mechanical Data
CASE: JEDEC DO-214AA molded Surface Mountable
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260
O
C for 10 seconds
For surface mount applications with flame retardent epoxy
Meeting UL94V-0
Cathode Band
J
A
C
Maximum Ratings
@
25
O
C Unless Otherwise Specified
Steady State
Power
Dissipation
Operation And
Storage
Temperature
Thermal
Resistance
P
(AV)
3.0W
(Note:1)
F
G
E
D
B
DIMENSIONS
T
J
, T
STG
R
-55
O
C to
+150
O
C
25
O
C/W
DIM
A
B
C
D
E
F
G
H
J
INCHES
MIN
.078
.075
.002
-----
.035
.065
.205
.160
.130
MAX
.116
.089
.008
.02
.055
.091
.224
.180
.155
MM
MIN
1.98
1.90
.05
-----
.90
1.65
5.21
4.06
3.30
MAX
2.95
2.25
.20
.51
1.40
2.32
5.69
4.57
3.94
NOTE
NOTE:
1.
Mounted on 4.0mm copper pads to each terminal.
Lead temperature at T
L
=75 C
o
2
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085”
0.070”
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