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LM6161J-QMLV

Description
IC OP-AMP, 10000 uV OFFSET-MAX, 50 MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8, Operational Amplifier
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size447KB,11 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric Compare

LM6161J-QMLV Overview

IC OP-AMP, 10000 uV OFFSET-MAX, 50 MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8, Operational Amplifier

LM6161J-QMLV Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
Parts packaging codeDIP
package instructionCERAMIC, DIP-8
Contacts8
Reach Compliance Codecompliant
ECCN codeEAR99
Amplifier typeOPERATIONAL AMPLIFIER
ArchitectureVOLTAGE-FEEDBACK
Maximum average bias current (IIB)6 µA
Maximum bias current (IIB) at 25C3 µA
Nominal Common Mode Rejection Ratio80 dB
frequency compensationYES
Maximum input offset voltage10000 µV
JESD-30 codeR-GDIP-T8
JESD-609 codee0
low-dissonanceNO
Negative supply voltage upper limit-18 V
Nominal Negative Supply Voltage (Vsup)-15 V
Number of functions1
Number of terminals8
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDIP
Encapsulate equivalent codeDIP8,.3
Package shapeRECTANGULAR
Package formIN-LINE
method of packingRAIL
power supply5/+-15 V
Certification statusNot Qualified
Filter levelMIL-STD-883
Maximum seat height5.08 mm
minimum slew rate180 V/us
Nominal slew rate300 V/us
Maximum slew rate6.8 mA
Supply voltage upper limit18 V
Nominal supply voltage (Vsup)15 V
surface mountNO
technologyBIPOLAR
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Nominal Uniform Gain Bandwidth50000 kHz
Minimum voltage gain300
width7.62 mm

LM6161J-QMLV Related Products

LM6161J-QMLV LM6161MD8
Description IC OP-AMP, 10000 uV OFFSET-MAX, 50 MHz BAND WIDTH, CDIP8, CERAMIC, DIP-8, Operational Amplifier IC OP-AMP, 7000 uV OFFSET-MAX, 50 MHz BAND WIDTH, UUC, DIE, Operational Amplifier
Maker National Semiconductor(TI ) National Semiconductor(TI )
Parts packaging code DIP WAFER
package instruction CERAMIC, DIP-8 DIE,
Reach Compliance Code compliant unknown
ECCN code EAR99 EAR99
Amplifier type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Maximum average bias current (IIB) 6 µA 6 µA
Nominal Common Mode Rejection Ratio 80 dB 94 dB
Maximum input offset voltage 10000 µV 7000 µV
JESD-30 code R-GDIP-T8 X-XUUC-N
Negative supply voltage upper limit -18 V -18 V
Number of functions 1 1
Package body material CERAMIC, GLASS-SEALED UNSPECIFIED
encapsulated code DIP DIE
Package shape RECTANGULAR UNSPECIFIED
Package form IN-LINE UNCASED CHIP
Certification status Not Qualified Not Qualified
Nominal slew rate 300 V/us 200 V/us
Supply voltage upper limit 18 V 18 V
surface mount NO YES
technology BIPOLAR BIPOLAR
Terminal form THROUGH-HOLE NO LEAD
Terminal location DUAL UPPER
Nominal Uniform Gain Bandwidth 50000 kHz 50000 kHz
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