IC,AUDIO AMPLIFIER,SINGLE,BIPOLAR,DIP,8PIN,PLASTIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| package instruction | DIP, DIP8,.3 |
| Reach Compliance Code | unknown |
| Commercial integrated circuit types | AUDIO AMPLIFIER |
| JESD-30 code | R-PDIP-T8 |
| JESD-609 code | e0 |
| Number of functions | 1 |
| Number of terminals | 8 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP8,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | BIPOLAR |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| LM1895N/B+ | LM1895N | LM2895P | LM1895N/A+ | |
|---|---|---|---|---|
| Description | IC,AUDIO AMPLIFIER,SINGLE,BIPOLAR,DIP,8PIN,PLASTIC | 1.1W, 1 CHANNEL, AUDIO AMPLIFIER, PDIP8, MINI, PLASTIC, DIP-8 | 4.3W, 1 CHANNEL, AUDIO AMPLIFIER, PSFM11, PLASTIC, SIP-11 | IC,AUDIO AMPLIFIER,SINGLE,BIPOLAR,DIP,8PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible |
| Maker | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| package instruction | DIP, DIP8,.3 | DIP, DIP8,.3 | TO-202, DIP8,.3 | DIP, DIP8,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| Commercial integrated circuit types | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 code | R-PDIP-T8 | R-PDIP-T8 | R-PSFM-T11 | R-PDIP-T8 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 8 | 8 | 11 | 8 |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| encapsulated code | DIP | DIP | TO-202 | DIP |
| Encapsulate equivalent code | DIP8,.3 | DIP8,.3 | DIP8,.3 | DIP8,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE | IN-LINE | FLANGE MOUNT | IN-LINE |
| surface mount | NO | NO | NO | NO |
| technology | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | SINGLE | DUAL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | - |
| ECCN code | - | EAR99 | EAR99 | EAR99 |
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