MCC
Features
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omponents
21201 Itasca Street Chatsworth
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P4SMAJ5.0
THRU
P4SMAJ170CA
400 Watt
Transient Voltage
Suppressors
5.0 to 170 Volts
DO-214AC
(SMAJ)( LEAD FRAME)
A
For Surface Mount Applications
Unidirectional And Bidirectional
Low Inductance
High Temp Soldering: 250°C for 10 Seconds At Terminals
For Bidirectional Devices Add “C” To The Suffix Of The Part
Number: i.e. P4SMAJ5.0C or P4SMAJ5.0CA for 5% Tolerance
0HFKDQLFDO'DWD
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Case: JEDEC DO-214AC
Terminals: Solderable per MIL-STD-750, Method 2026
Polarity: Indicated by cathode band except bi-directional types
0D[LPXP5DWLQJ
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Operating Temperature: -55°C to +150°C
Storage Temperature: -55°C to +150°C
Typical Thermal Resistance: 25 /W Junction to Ambient
C
B
:
F
H
Peak Pulse Current on
10/1000
D
V :DYHIRUP
I
PPM
P
PPM
P
M(AV)
I
FSM
See Table 1 Note 1
E
DIMENSIONS
G
Peak Pulse Power Dissipation
Steady State Power Dissipation
Peak Forward Surge Current
Min 400 W
1.0 W
40A
Note 1, 5
Note 2, 4
Note:4
DIM
A
B
C
D
E
F
G
H
INCHES
MIN
.157
.098
.006
.030
.188
.078
.055
.002
MAX
.181
.114
.012
.060
.208
.096
.062
.008
MM
MIN
4.00
2.50
0.152
0.76
4.80
2.00
1.40
0.051
MAX
4.60
2.90
0.305
1
..52
5.28
2.44
1.60
0.203
NOTE
Notes: 1. Non-repetitive current pulse, per Fig.3 and derated above
T
A
=25 per Fig.2.
2. Mounted on 5.0mm
2
copper pads to each terminal.
3. 8.3ms, single half sine wave duty cycle = 4 pulses per
Minutes maximum.
4. Lead temperature at T
L
= 75 .
5. Peak pulse power waveform is 10/1000
.
:
SUGGESTED SOLDER
PAD LAYOUT
0.085 ”
MA X
5”
:
V
0.058 ” MI N
5”
0.05
MI N
5”
5”
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P4SMAJ5.0 thru P4SMAJ170CA
100
MCC
75
50
P
PPM
, PEAK PULSE POWER, KW
100
NON-REPETITIVE
PULSE WAVEFORM
SHOWN IN FIGURE 3
TA = 25
¢J
10
1.0
MOUNTED ON 5.0mm
2
COPPER LAND AREAS
0.1
0.1
£gs
1.0
£gs
10
£gs
100
£gs
1.0ms
10ms
PEAK PULSE POWER(Ppp) OR
CURRENT(Ipp) DERATING IN
PERCENTAGE %
25
0
0
25
50
75
100
125
150
175
200
td, PULSE WIDTH, SEC
T
A
, AMBIENT TEMPERATURE,
¢J
Fig. 1-PEAK PULSE POWER RATING CURVE
Fig. 2-PULSE RATING CURVE
10,000
TJ = 25
¢J
f = 1.0MHz
Vsig = 50mVp-p
MEASURED AT
ZERO BIAS
150
TA = 25
¢J
tf = 10
£g
sec
Peak Value Ippm
100
Half Value- Ipp
2
50
10/1000
£g
sec Waveform
as Defined by R.E.A.
Pulse Width(td) is Defined as the
Point Where the Peak Current
Decays to 50% of lpp
40,000
20,000
Ippm, PEAK PULSE CURRENT, %
CJ, CAPACITANCE, pF
1,000
6,000
4,000
2,000
100
500
MEASURED AT
STAND-OFF
VOLTAGE(VMW)
200
0
0
td
1.0
2.0
3.0
e-kt
4.0
10
1.0
2.0
5.0
10
20
50
100
200
t, TIME , ms
V(BR), BREAKDOWN VOLTAGE, VOLTS
Fig. 3-PULSE WAVEFORM
50
Fig. 4-TYPICAL JUNCTION CAPACITANCE
Ifsm, PEAK FORWARD SURGE
CURRENT, AMPERES
40
T
J
= T max
J
8.3mss SINGLE HALF
SINCE-WAVE JEDEC
METHOD
30
20
10
0
1
2
4
10 20
40
100
NUMBER OF CYCLES AT 60Hz
Fig. 5-MAXIMUM NON-REPETITIVE PEAK FORWARD
SURGE CURRENT
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Microcontroller MCU
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