Programmable Logic Device, PLS-Type, CMOS, PQCC28,
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown |
| Architecture | PLS-TYPE |
| maximum clock frequency | 14.9 MHz |
| JESD-30 code | S-PQCC-J28 |
| JESD-609 code | e0 |
| Number of entries | 42 |
| Output times | 12 |
| Number of product terms | 105 |
| Number of terminals | 28 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QCCJ |
| Encapsulate equivalent code | LDCC28,.5SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 5 V |
| Certification status | Not Qualified |
| Nominal supply voltage | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| PLC42VA12IA | PLC42VA12IFA | PLC42VA12IN | |
|---|---|---|---|
| Description | Programmable Logic Device, PLS-Type, CMOS, PQCC28, | Programmable Logic Device, PLS-Type, CMOS, CDIP24, | Programmable Logic Device, PLS-Type, CMOS, PDIP24, |
| Is it Rohs certified? | incompatible | incompatible | incompatible |
| Maker | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| Reach Compliance Code | unknown | unknown | unknown |
| Architecture | PLS-TYPE | PLS-TYPE | PLS-TYPE |
| maximum clock frequency | 14.9 MHz | 14.9 MHz | 14.9 MHz |
| JESD-30 code | S-PQCC-J28 | R-XDIP-T24 | R-PDIP-T24 |
| JESD-609 code | e0 | e0 | e0 |
| Number of entries | 42 | 42 | 42 |
| Output times | 12 | 12 | 12 |
| Number of product terms | 105 | 105 | 105 |
| Number of terminals | 28 | 24 | 24 |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | QCCJ | DIP | DIP |
| Encapsulate equivalent code | LDCC28,.5SQ | DIP24,.3 | DIP24,.3 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | IN-LINE | IN-LINE |
| power supply | 5 V | 5 V | 5 V |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Nominal supply voltage | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO |
| technology | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | J BEND | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | QUAD | DUAL | DUAL |
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